Design and Key Technologies of High-power Press-pack IGBT Device

It presented the advantages of high-power press-pack IGBT device with respect to conventional soldering device. In the aspect of device design, insulation and blocking failure mechanism were analyzed as well as optimized solution which increasing the dielectric strength of contacting media. Influen...

وصف كامل

التفاصيل البيبلوغرافية

الحاوية / القاعدة:	Kongzhi Yu Xinxi Jishu
المؤلفون الرئيسيون:	DOU Zechun, LIU Guoyou, CHEN Jun, LI Xiaolin, PENG Yongdian, LI Jilu
التنسيق:	مقال
اللغة:	الصينية
منشور في:	Editorial Office of Control and Information Technology 2016-01-01
الموضوعات:	press-pack IGBT insulation and withstand voltage even pressure distribution thermal design fail to short-circuit
الوصول للمادة أونلاين:	http://ctet.csrzic.com/thesisDetails#10.13889/j.issn.2095-3631.2016.02.005