Design and Key Technologies of High-power Press-pack IGBT Device

It presented the advantages of high-power press-pack IGBT device with respect to conventional soldering device. In the aspect of device design, insulation and blocking failure mechanism were analyzed as well as optimized solution which increasing the dielectric strength of contacting media. Influen...

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Bibliographic Details
Published in:Kongzhi Yu Xinxi Jishu
Main Authors: DOU Zechun, LIU Guoyou, CHEN Jun, LI Xiaolin, PENG Yongdian, LI Jilu
Format: Article
Language:Chinese
Published: Editorial Office of Control and Information Technology 2016-01-01
Subjects:
press-pack IGBT
insulation and withstand voltage
even pressure distribution
thermal design
fail to short-circuit
Online Access:http://ctet.csrzic.com/thesisDetails#10.13889/j.issn.2095-3631.2016.02.005
Description
Summary:It presented the advantages of high-power press-pack IGBT device with respect to conventional soldering device. In the aspect of device design, insulation and blocking failure mechanism were analyzed as well as optimized solution which increasing the dielectric strength of contacting media. Influence of pressure distribution was introduced along with several solutions, and several optimized thermal deign and fail to short-circuit mechanism were analyzed. In the end, silver sintering, integrated cooler and SiC press-pack were introduced as its future technical trends.
ISSN:2096-5427

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