Thermal Conductivity Enhancement of Epoxy Adhesives Using Boron Nitride and Alumina Ceramic Fillers

One of the methods for improving thermal conductivity of epoxy adhesives is the incorporation of conductive ceramic, metal or carbon fillers. As the main goal of this research is to improve the thermal conductivity of epoxy resin and keep its electrical insulating property, the effect of Alumina (Al...

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Bibliographic Details

Published in:	علوم، فناوری و کاربردهای فضایی
Main Authors:	Sajede Aghasi, Seyed Hassan Jafari, Mahdi Golriz
Format:	Article
Language:	Persian
Published:	Iranian Space Research Institute 2023-02-01
Subjects:	thermal diffusivity# epoxy adhesive# ceramic fillers# boron nitride# alumina# thermal conductivity
Online Access:	https://journal.isrc.ac.ir/article_161963_5078eb9e8d6a64e9674053f984068b8d.pdf