Effect of Grain Structure and Ni/Au-UBM Layer on Electromigration-Induced Failure Mechanism in Sn-3.0Ag-0.5Cu Solder Joints

The development of advanced electronic devices leads to highly miniaturized interconnect circuits (ICs), which significantly increases the electromigration (EM) phenomenon of solder and circuits due to higher current density. The electromigration of solder joints under high current density has becom...

وصف كامل

التفاصيل البيبلوغرافية
الحاوية / القاعدة:Micromachines
المؤلفون الرئيسيون: Yuanxiang Zhang, Jicheng Zhang, Yong Wang, Yike Fang
التنسيق: مقال
اللغة:الإنجليزية
منشور في: MDPI AG 2022-06-01
الموضوعات:
electromigration
microstructure
solder bump
failure mechanism
misorientation angle
الوصول للمادة أونلاين:https://www.mdpi.com/2072-666X/13/6/953

الانترنت

https://www.mdpi.com/2072-666X/13/6/953

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