Comparative assessment of shear bond strength and adhesive remnant scores of orthodontic adhesive containing copper-substituted hydroxyapatite nanoparticles with conventional orthodontic adhesive: An in vitro study

BACKGROUND: An ideal orthodontic adhesive should provide a bond strong enough to withstand the forces of orthodontic treatment and mastication without dislodging, while also being safe enough to prevent surface damage debonding. Shear bond strength (SBS) is a critical factor that determines the qual...

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Bibliographic Details

Published in:	Journal of Orthodontic Science
Main Authors:	Kavitha Ramsundar, Remmiya Mary Varghese, Nivethigaa Balakrishnan, Aravind Kumar Subramanian
Format:	Article
Language:	English
Published:	Wolters Kluwer Medknow Publications 2025-09-01
Subjects:	adhesives bonding copper dental nanotechnology orthodontics sustainable
Online Access:	https://journals.lww.com/10.4103/jos.jos_98_24