The Influence of Mg Additive on the Structure and Electrical Conductivity of Pure Copper Castings

The aim of this paper was to attain defect free, pure copper castings with the highest possible electrical conductivity. In this connection, the effect of magnesium additives on the structure, the degree of undercooling (ΔTα = Tα-Tmin, where Tα - the equilibrium solidification temperature, Tmin - th...

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出版年:	Archives of Foundry Engineering
主要な著者:	Kranc M., Sikora G., Górny M., Garbacz-Klempka A.
フォーマット:	論文
言語:	英語
出版事項:	Polish Academy of Sciences 2017-12-01
主題:	Solidification Process Primary grains Pure copper Castings Mg additive Electrical conductivity
オンライン･アクセス:	http://www.degruyter.com/view/j/afe.2017.17.issue-4/afe-2017-0135/afe-2017-0135.xml?format=INT