Diffusion Bonding of FGH 98 and CoCrNi-Based Medium-Entropy Alloy: Microstructure Evolution and Mechanical Tests

The superalloy FGH98 was successfully diffusion bonded (DB) with medium-entropy alloy (MEA) Al₃Ti₃(CrCoNi)₉₄ using pure Ni as the interlayer at a temperature range of 1050–1170 °C for 1 h under 5 MPa. The microstructure and mechani...

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Bibliographic Details

Published in:	Crystals
Main Authors:	Yajie Du, Zhaoxi Li, Jiangtao Xiong, Yipeng Chen, Shiwei Li, Jinglong Li, Jihong Dong
Format:	Article
Language:	English
Published:	MDPI AG 2021-09-01
Subjects:	medium-entropy alloy powder superalloy diffusion bonding microstructure mechanical properties
Online Access:	https://www.mdpi.com/2073-4352/11/10/1158