Hydrothermal performance of a heat sink using Plate-fins: Experimental and numerical investigations

The development of electronic devices is accompanied by the generation of significant heat. A novel plate-fins design with various orientation angles of 30°, 35°, 37.5°, 40° and 45° was studied. The plate-fins design aims to boost the performance by increasing the surface area and redirecting airflo...

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Bibliographic Details

Published in:	International Journal of Thermofluids
Main Authors:	Mohammad Ismail, Ahmad Manasrah, Abdullah Masoud Ali, Mousa Abedalaziz
Format:	Article
Language:	English
Published:	Elsevier 2024-08-01
Subjects:	Heat sink Pin-fins, Plate-fins CPU Thermal management Electronics devices
Online Access:	http://www.sciencedirect.com/science/article/pii/S2666202724002544