Metallization of polyetherimide with 3D structures by supercritical carbon dioxide-assisted electroless NiP plating

Polyetherimide (PEI) with 3-dimensional (3D) structures is a promising material for applications in electronic devices because of its numerous attractive properties. In the applications of PEI, the low electrical conductivity is often a shortcoming. The electrical conductivity can be improved by a m...

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Bibliographic Details

Published in:	Micro and Nano Engineering
Main Authors:	Ami Iwasaki, Tomoyuki Kurioka, Po-Wei Cheng, Chun-Yi Chen, Tso-Fu Mark Chang, Kei Takase, Hiroshi Ishihata, Masato Sone
Format:	Article
Language:	English
Published:	Elsevier 2024-09-01
Subjects:	Polyetherimide Supercritical carbon dioxide 3D structures Catalyzation step Electroless NiP plating Metallization
Online Access:	http://www.sciencedirect.com/science/article/pii/S2590007224000340