Thin‐Film Assisted Laser Transfer and Bonding (TFA‐LTAB) for the Fabrication of Micro‐LED Displays

Abstract Micro‐Light Emitting Diodes (Micro‐LEDs) are key components in the field of next‐generation display technologies. In the process of making Micro‐LED displays, millions of chips need to be transferred to the driver substrate using mass transfer technology. Conventional transfer techniques, s...

詳細記述

書誌詳細

出版年:	Advanced Electronic Materials
主要な著者:	Taifu Lang, Xin Lin, Xiaowei Huang, Yujie Xie, Shuangjia Bai, Yijian Zhou, Shuaishuai Wang, Yu Lu, Xuehuang Tang, Chang Lin, Zhonghang Huang, Kaixin Zhang, Qun Yan, Jie Sun
フォーマット:	論文
言語:	英語
出版事項:	Wiley-VCH 2025-03-01
主題:	bonding micro‐LED TFA‐LTAB transfer
オンライン･アクセス:	https://doi.org/10.1002/aelm.202400380