Strengthening of 3D printed Cu micropillar in Cu-Ni core-shell structure

Direct printing of complex 3D structures at the nano- and microscale is a promising technique for MEMS devices, small-scale sensors, and actuators. So far, most studies have been focused on printing copper (Cu) structures due to the high Coulombic efficiency compared to other conductive metals such...

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Bibliographic Details
Published in:Materials & Design
Main Authors: Manish Jain, Amit Sharma, Patrik Schürch, Nicolo Maria Della Ventura, Wabe W. Koelmans, Xavier Maeder, Jakob Schwiedrzik, Johann Michler
Format: Article
Language:English
Published: Elsevier 2023-03-01
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Online Access:http://www.sciencedirect.com/science/article/pii/S0264127523001326