Computational assessment of Sn activities and integral excess free energy change for mixing in the Sn-Au-Cu ternary liquid alloys using the molecular interaction volume model

The activities of Sn in the liquid solder ternary alloy Sn-Au-Cu at 900 K have been computed using the molecular interaction volume model (MIVM). The calculated values have been compared with the experimental data for three cross-sections, i.e., for three different ratios of aurum to copper (X _Au :...

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Bibliographic Details

Published in:	Journal of Physics Communications
Main Authors:	Sanjay Kumar Sah, Ishwar Koirala
Format:	Article
Language:	English
Published:	IOP Publishing 2023-01-01
Subjects:	solder alloys activity molecular interaction volume model ternary liquid alloys integral excess Gibbs free energy
Online Access:	https://doi.org/10.1088/2399-6528/ad035a