MEMS Reliability: On-Chip Testing for the Characterization of the Out-of-Plane Polysilicon Strength

Polycrystalline silicon is a brittle material, and its strength results are stochastically linked to microscale (or even nanoscale) defects, possibly dependent on the grain size and morphology. In this paper, we focus on the out-of-plane tensile strength of columnar polysilicon. The investigation ha...

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Bibliographic Details
Published in:Micromachines
Main Authors: Tiago Vicentini Ferreira do Valle, Stefano Mariani, Aldo Ghisi, Biagio De Masi, Francesco Rizzini, Gabriele Gattere, Carlo Valzasina
Format: Article
Language:English
Published: MDPI AG 2023-02-01
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Online Access:https://www.mdpi.com/2072-666X/14/2/443