MEMS Reliability: On-Chip Testing for the Characterization of the Out-of-Plane Polysilicon Strength
Polycrystalline silicon is a brittle material, and its strength results are stochastically linked to microscale (or even nanoscale) defects, possibly dependent on the grain size and morphology. In this paper, we focus on the out-of-plane tensile strength of columnar polysilicon. The investigation ha...
| Published in: | Micromachines |
|---|---|
| Main Authors: | , , , , , , |
| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2023-02-01
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| Subjects: | |
| Online Access: | https://www.mdpi.com/2072-666X/14/2/443 |
