EFFECT OF DIE ADHESIVE ON THE PERFORMANCE OF HIGH-G MEMS ACCELEROMETER

The sensitivity and reliability of packaged high-g MEMS accelerometer strongly depends on die attach quality that should pay special attention in the operation. A package method based on die attach is presented for a prepared MEMS high-g accelerometers by using two die attach adhesives with differen...

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Bibliographic Details

Published in:	Jixie qiangdu
Main Authors:	GUO HuiYu, WEN Feng, KANG Qiang, SHI YunBo, WANG YanYang
Format:	Article
Language:	Chinese
Published:	Editorial Office of Journal of Mechanical Strength 2018-01-01
Subjects:	Packaging Die process High-g MEMS accelerometer Elastic modulus Finite element analysis（FEA） Hopkinson Bar
Online Access:	http://www.jxqd.net.cn/thesisDetails#10.16579/j.issn.1001.9669.2018.01.015