Reliability of SnPbSb/Cu Solder Joint in the High-Temperature Application

With the continuous miniaturization and increase in functionality of the electronic devices used in the aerospace and national defense industries, the requirements for reliability of the solder joints in these devices keep increasing. In this study, a SnPbSb solder with excellent wettability was use...

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Bibliographic Details

Published in:	Crystals
Main Authors:	Jiachen Xu, Yucan Fu, Xiaoxiao Zhou, Junqian Zhang, Songbai Xue
Format:	Article
Language:	English
Published:	MDPI AG 2022-11-01
Subjects:	soldering SnPbSb solder high-temperature aging microstructure shear strength
Online Access:	https://www.mdpi.com/2073-4352/12/12/1724