Comparison between bulk and particle solder alloy on the performance of low-melting solder joints

The influence of uniformity and small size solder particles on microstructure evolution and mechanical performances of low temperature soldering joints was investigated. First, experiments were set up to obtain uniform and small-size solder particles, which were compared to bulk solder joints by usi...

詳細記述

書誌詳細
出版年:Journal of Materials Research and Technology
主要な著者: Mingkun Yang, Xiuchen Zhao, Yongjun Huo, King-Ning Tu, Yingxia Liu
フォーマット: 論文
言語:英語
出版事項: Elsevier 2023-05-01
主題:
オンライン・アクセス:http://www.sciencedirect.com/science/article/pii/S2238785423004593