Effect of 0.05 wt.% Pr Addition on Microstructure and Shear Strength of Sn-0.3Ag-0.7Cu/Cu Solder Joint during the Thermal Aging Process

The evolution of interfacial morphology and shear strengths of the joints soldered with Sn-0.3Ag-0.7Cu (SAC0307) and SAC0307-0.05Pr aged at 150 °C for different times (h; up to 840 h) were investigated. The experiments showed the electronic joint soldered with SAC0307-0.05Pr has a much high...

Full description

Bibliographic Details

Published in:	Applied Sciences
Main Authors:	Jie Wu, Songbai Xue, Jingwen Wang, Guoqiang Huang
Format:	Article
Language:	English
Published:	MDPI AG 2019-09-01
Subjects:	SAC0307-0.05Pr solder aging process interfacial microstructure fractograph
Online Access:	https://www.mdpi.com/2076-3417/9/17/3590