APA (7th ed.) Citation

Wu, J., Xue, S., Wang, J., & Huang, G. (2019, September). Effect of 0.05 wt.% Pr Addition on Microstructure and Shear Strength of Sn-0.3Ag-0.7Cu/Cu Solder Joint during the Thermal Aging Process. Applied Sciences.

Chicago Style (17th ed.) Citation

Wu, Jie, Songbai Xue, Jingwen Wang, and Guoqiang Huang. "Effect of 0.05 Wt.% Pr Addition on Microstructure and Shear Strength of Sn-0.3Ag-0.7Cu/Cu Solder Joint During the Thermal Aging Process." Applied Sciences Sep. 2019.

MLA (9th ed.) Citation

Wu, Jie, et al. "Effect of 0.05 Wt.% Pr Addition on Microstructure and Shear Strength of Sn-0.3Ag-0.7Cu/Cu Solder Joint During the Thermal Aging Process." Applied Sciences, Sep. 2019.