Interfacial reaction and mechanical properties of Sn–Bi Cu core solder joints
Sn–Bi solder, considered to be a lead-free solder that can be used in the packaging of heat-sensitive devices, has been attracting increasing attention from researchers due to its excellent mechanical properties. The microstructure evolution, interfacial reaction, shear properties, and fracture beha...
| 發表在: | Journal of Materials Research and Technology |
|---|---|
| Main Authors: | , , , , , |
| 格式: | Article |
| 語言: | 英语 |
| 出版: |
Elsevier
2024-11-01
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| 主題: | |
| 在線閱讀: | http://www.sciencedirect.com/science/article/pii/S2238785424026371 |