Co-W Barrier Layers for Metallization of Copper Interconnects: Thermal Performance Analysis

The back-end-of-line (BEOL) copper interconnect structure has been subjected to downscaling for the last two decades, while the materials used for conforming and assuring its physical integrity during processing have faced significant obstacles as the single-digit nanometer process node is implement...

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Bibliographic Details

Published in:	Nanomaterials
Main Authors:	Bruno M. C. Oliveira, Ruben F. Santos, Ana P. Piedade, Paulo J. Ferreira, Manuel F. Vieira
Format:	Article
Language:	English
Published:	MDPI AG 2022-05-01
Subjects:	barrier layers dewetting cobalt tungsten copper metallization
Online Access:	https://www.mdpi.com/2079-4991/12/10/1752