Improvement of Laser Damage Resistance of Fused Silica Using Oxygen-Aided Reactive Ion Etching

Reactive ion etching (RIE) with fluorocarbon plasma is a facile method to tracelessly remove the subsurface damage layer of fused silica but has the drawback of unsatisfactory improvement in laser damage resistance due to the induction of secondary defects. This work proposes to incorporate O<sub...

詳細記述

書誌詳細

出版年:	Photonics
主要な著者:	Ting Shao, Jun Zhang, Zhaohua Shi, Weihua Li, Ping Li, Laixi Sun, Wanguo Zheng
フォーマット:	論文
言語:	英語
出版事項:	MDPI AG 2024-08-01
主題:	fused silica laser-induced damage reactive ion etching (RIE) oxygen
オンライン･アクセス:	https://www.mdpi.com/2304-6732/11/8/726