Monodisperse SiO₂ Spheres: Efficient Synthesis and Applications in Chemical Mechanical Polishing

The atomic level polishing of a material surface affects the accuracy of devices and the application of materials. Silica slurries play an important role in chemical mechanical polishing (CMP) by polishing the material surface. In this study, an efficient and controllable Stöber approach was develop...

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Bibliographic Details

Published in:	Nanomaterials
Main Authors:	Jinlong Ge, Yu Cao, Hui Han, Xiaoqi Jin, Jing Liu, Yuhong Jiao, Qiuqin Wang, Yan Gao
Format:	Article
Language:	English
Published:	MDPI AG 2025-04-01
Subjects:	Stöber method SiO<sub>2</sub> sphere chemical mechanical polishing planarization SiO<sub>2</sub> slurry
Online Access:	https://www.mdpi.com/2079-4991/15/9/665