Showing 21 - 40 results of 46 for search 'Ker-Chang Hsieh', query time: 0.12s Refine Results
  1. 21
    The Study of Microstructure Analysis of Sn-Zn And Sn-Zn-Al Solder Ball in BGA Package.
    by Shuo-hung Wang, 王碩宏
    Published 2004
    Other Authors: “...Ker-chang Hsieh...”
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  2. 22
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    by Chih-Yu Cho, 卓致有
    Published 2004
    Other Authors: “...Ker-Chang Hsieh...”
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  3. 23
    The Study of Tin Whisker Growth with Irregular Tin Grain Structure
    by Cheng-fu Yu, 余正富
    Published 2010
    Other Authors: “...Ker-Chang Hsieh...”
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  4. 24
    Fe-Al-Mn-C Phase Diagram Study
    by Yi-Chen Wu, 吳宜珍
    Published 2013
    Other Authors: “...Ker-Chang Hsieh...”
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  5. 25
    The EMF Measurement Of Aluminum Activity In Galvanizing
    by Bo-Lin Jian, 簡伯霖
    Published 2011
    Other Authors: “...Ker-Chang Hsieh...”
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  6. 26
    The Study of Fe-Al-Mn-C Phase Diagram
    by Pi-Wei Yang, 楊璧瑋
    Published 2012
    Other Authors: “...Ker-Chang Hsieh...”
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  7. 27
    Thermodynamic properties of liquid Al-Sn-Zn alloys
    by Bang-Yan Chen, 陳邦硯
    Published 2012
    Other Authors: “...Ker-Chang Hsieh...”
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  8. 28
    The Reliability Study of Cu Wire Bonding
    by Kuo-Chuan Hsu, 許國銓
    Published 2012
    Other Authors: “...Ker-Chang Hsieh...”
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  9. 29
    Interfacial Reactions of Sn-Zn, Sn-Zn-Al, and Sn-Zn-Bi Solder Balls with Au/Ni Pad in BGA Package
    by Shih-Chang Chang, 張世璋
    Published 2005
    Other Authors: “...Ker-Chang Hsieh...”
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  10. 30
    Microstructure Analysis of Sn-Ag-Cu Solder Ball in BGA Package
    by Kuei-Min Chang, 張貴閔
    Published 2005
    Other Authors: “...Ker-Chang Hsieh...”
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  11. 31
    Temperature and bias ffect on wire-bond reliability for F1 & S2 type new wire evaluatione
    by Chen-may Huang, 黃岑媺
    Published 2003
    Other Authors: “...Ker-Chang Hsieh...”
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  12. 32
    Temperature, Bias Effect and Chloride Ion on Wire-Bond Reliability
    by Min-Hsien Lue, 呂旻憲
    Published 2003
    Other Authors: “...Ker-Chang Hsieh...”
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  13. 33
    Interfacial Reactions of Sn-Ag-Cu Solder Ballin BGA Package at 175℃ aging
    by Hsin-I Wang, 王馨儀
    Published 2005
    Other Authors: “...Ker-Chang Hsieh...”
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  14. 34
    Study on the Weldability of New High Performance High-Entropy Alloys
    by Yao-Jen Lei, 雷堯仁
    Published 2006
    Other Authors: “...Ker-Chang Hsieh...”
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  15. 35
    Sn-Ag-Cu Solder Reliability and Ring Pattern Formation Mechanism
    by Sheng-Chih Lin, 林勝志
    Published 2006
    Other Authors: “...Ker-Chang Hsieh...”
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  16. 36
    The Effect of Chloride Ion and Copper Oxide Layer on Plastic-encapsulated Package Reliability
    by Sheng-Tzung Huang, 黃聖棕
    Published 2001
    Other Authors: “...Ker-Chang Hsieh...”
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  17. 37
    Assessment of Ag-Al-Pd Ternary Phase Diagram
    by Jung-Yi Chen, 陳俊毅
    Published 2013
    Other Authors: “...Ker-Chang Hsieh...”
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  18. 38
    Al-Au-Cu and Al-Au-Pd phase diagram study using diffusion couples
    by Jyun-lin Li, 李俊霖
    Published 2008
    Other Authors: “...Ker-Chang Hsieh...”
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  19. 39
    Short-range order study on Zr based bulk metallic glass
    by Min-chi Yeh, 葉銘騏
    Published 2014
    Other Authors: “...Ker-Chang Hsieh...”
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  20. 40
    Ti-Co-Ni and Ti-Pt-Ag 800 oC Phase Diagrams Study
    by Yin-ying Su, 蘇音瑛
    Published 2016
    Other Authors: “...Ker-Chang Hsieh...”
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