Showing 141 - 160 results of 180 for search 'Y. Tsai', query time: 0.11s Refine Results
  1. 141
    EMC-Induced Thermal Deformations and Residual Stresses in IC Packaging
    by Wang Chih Tung, 王志棟
    Published 2002
    Other Authors: “...M. Y. Tsai...”
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  2. 142
    Strength of Cu-TSV Chips Used in 3DIC Packaging
    by Yi Chen Chao, 趙翌辰
    Published 2014
    Other Authors: “...M. Y. Tsai...”
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  3. 143
    Thermal Analysis and Reliability of Light Bar and its Modules
    by Cheng En Zheng, 鄭承恩
    Published 2014
    Other Authors: “...M. Y. Tsai...”
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  4. 144
    Measurement and Analysis of Thermal Deformation of WBGA Packages and Assembly
    by Ming Lun Hsieh, 謝銘倫
    Published 2010
    Other Authors: “...M. Y. Tsai...”
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  5. 145
    Thermal Analyses and Measurements of LED Array and Module
    by Meng Ru Tsai, 蔡孟儒
    Published 2010
    Other Authors: “...M. Y. Tsai...”
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  6. 146
    Thermal Analyses of DRAM Modules with 3D Chip-Stacked Packages
    by Chen Nan Hsiao, 蕭楨楠
    Published 2011
    Other Authors: “...M. Y. Tsai...”
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  7. 147
    Effects of Phosphor Concentration on Optical Properties of White Light LED Packages : Analysis and Measurement
    by Shien Yue Tsai, 蔡憲嶽
    Published 2011
    Other Authors: “...M. Y. Tsai...”
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  8. 148
    Effects of Material Properties, Stacking Type, Process and Residual Strains on Thermal Deformation of Stacked Die Packages
    by Chao Wei Chang, 張兆瑋
    Published 2013
    Other Authors: “...M.Y. Tsai...”
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  9. 149
    Effect of Materials Interfacial Strength and Environmental Conditions on Reliability of LED Packages
    by You Lin Peng, 彭宥箖
    Published 2013
    Other Authors: “...M. Y. Tsai...”
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  10. 150
    Effects of Moisture and Temperature on the Reliability of LED Packages: Measurements and Analyses
    by Chia Hung Wang, 王嘉宏
    Published 2011
    Other Authors: “...M. Y. Tsai...”
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  11. 151
    Thermal, Mechanical, and Reliability Analyses of High-Power LED Packages and Their Modules
    by Chun Hung Chen, 陳俊宏
    Published 2010
    Other Authors: “...M. Y. Tsai...”
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  12. 152
    A Study on Reciprocal Screw Theory Using Orthogonal Concept
    by S. S. Chen, 陳聖欣
    Published 1993
    Other Authors: “...K. Y. Tsai...”
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  13. 153
    A Study on the Orinetation Workspace of 6-DOF Parallel Manipulators
    by CHIU CHUN CHENG, 邱鈞鉦
    Published 2003
    Other Authors: “...Kao Y. Tsai...”
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  14. 154
    Thermal Analysis and Measurement of LED Package
    by C. H. Cen, 陳俊宏
    Published 2004
    Other Authors: “...M. Y. Tsai...”
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  15. 155
    The Design of Isotropic Planar and 3-DOF Spatial Manipulators
    by Lin Wei Szu, 林維賜
    Published 2000
    Other Authors: “...Kao Y. Tsai...”
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  16. 156
    Manpulability and Transmission Measures of Manipulators and Mechanisms
    by LIN JIUNN-CHERNG, 林俊呈
    Published 2000
    Other Authors: “...K.Y.Tsai...”
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  17. 157
    Investigation of Thermally-Induced Warpage of Package on Package
    by Po Chen Kuo, 郭柏辰
    Published 2008
    Other Authors: “...M. Y. Tsai...”
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  18. 158
    The Effects of Pressure, Moisture, and Temperature on the Reliability of High-Power LED Packages
    by Wan Lin Tsai, 蔡宛霖
    Published 2008
    Other Authors: “...M. Y. Tsai...”
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  19. 159
    Optical Design, Analysis and Measurement of High-Power LED Packages
    by Jhong Yi Tang, 唐忠毅
    Published 2008
    Other Authors: “...M. Y. Tsai...”
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  20. 160
    The effect of substrate mechanical properties on warpage of fcbga packages
    by hsiang yu chang, 張翔昱
    Published 2008
    Other Authors: “...M.Y. Tsai...”
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