Showing 1 - 18 results of 18 for search 'Gien-Huang Wu', query time: 0.22s Refine Results
  1. 1
    Analysis of thermal strain for FCFBGA with Copper Pillar Bump
    by Chun-LungFANG, 方俊龍
    Published 2018
    Other Authors: “...Gien-Huang Wu...”
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  2. 2
    Parametric Anaysis of POP Thermal Performance
    by Tzu-HsuanChou, 周子軒
    Published 2017
    Other Authors: “...Gien-Huang Wu...”
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  3. 3
    Reliability of Flip Chip-Plastic Ball Grid Array Package
    by Chen-JungWong, 翁振榮
    Published 2012
    Other Authors: “...Gien-Huang Wu...”
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  4. 4
    Analysis of Thermal mechanical behaviors for Flip-Chip Ball Grid Array packaging
    by Chia-FanLin, 林家帆
    Published 2013
    Other Authors: “...Gien-Huang Wu...”
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  5. 5
    Investigation of the Reliability in Thermally Enhanced Flip Chip PBGA Packages
    by Tien-PeiLiu, 劉天培
    Published 2011
    Other Authors: “...Gien-Huang Wu...”
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  6. 6
    The Analysis of the Thermal Characterization and Fatigue of Package-On-Package (POP) Assembly
    by Fu-TingWu, 吳輔庭
    Published 2011
    Other Authors: “...Gien-Huang Wu...”
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  7. 7
    Application of Taguchi Method in Thermal Stress Analysis of Solder Ball for the Flip-Chip Package
    by Shing-Cheng Chang, 張勳承
    Published 2003
    Other Authors: “...Gien-Huang Wu...”
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  8. 8
    The Study of Wire Sweep in IC Package
    by Yung-Yuh Tzeng, 曾永裕
    Published 2003
    Other Authors: “...Gien-Huang Wu...”
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  9. 9
    Fatigue Analysis for Thermally Enhanced FC-PBGA Assembly using lead free 95.5Sn4.0Ag0.5Cu Solder
    by Zhi-Cheng-Huang, 黃致澄
    Published 2015
    Other Authors: “...Gien-Huang Wu...”
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  10. 10
    The study of heat transfer of PBGA package with Thermal Enchancement
    by Chieh-Wei Hsu, 許介維
    Published 2008
    Other Authors: “...Gien-Huang Wu...”
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  11. 11
    The Simulation of Reflow Process-Induced Residual Stress of micro-BGA Package
    by Guo-kai Xiao, 蕭國凱
    Published 2009
    Other Authors: “...Gien-Huang Wu...”
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  12. 12
    Theoretical Analysis and Experiment of Fluid Flow of Slurry and Tribological Behavior in the Chemical Mechanical Polishing of a Silicon Wafer
    by Chen-Chung Lee, 李臻誠
    Published 1999
    Other Authors: “...Gien-Huang Wu...”
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  13. 13
    The Study of Ribbed Plate Design by Injection Molding
    by Jin-Chieh Liang, 梁晋恊
    Published 2006
    Other Authors: “...Gien-Huang Wu...”
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  14. 14
    Reliability Analysis for Solder Balls of PBGA Package under Thermal Loading
    by JUI-PING HUANG, 黃瑞平
    Published 2006
    Other Authors: “...Gien-Huang Wu...”
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  15. 15
    Effect of solder-ball pitch on the reliability of a thermally enhanced FC-PBGA assembly
    by Ping-ChunShih, 施秉均
    Published 2014
    Other Authors: “...Gien-Huang Wu...”
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  16. 16
    The study of heat transfer of a Package-on-package assembly
    by Ching-HungChou, 周景弘
    Published 2016
    Other Authors: “...Gien-Huang Wu...”
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  17. 17
    The numerical simulation and optimization of PBGA package
    by Chia-Sheng Lo, 羅家昇
    Published 2005
    Other Authors: “...Gien-Huang Wu...”
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  18. 18
    The Study of Maximum Equivalent Strain of PBGA Package under Thermal cycles
    by Yu-Zhi Liu, 劉育志
    Published 2005
    Other Authors: “...Gien-Huang Wu...”
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