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  1. 1
    Self repair of thin film gold line in electronic packaging
    by LIAO,XIN-YI, 廖信一
    Published 1991
    Other Authors: “...HU,DI-QUN...”
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  2. 2
    Adhesion of polyimide film to silicon substrate
    by CHEN,XI-JIE, 陳錫杰
    Published 1991
    Other Authors: “...HU,DI-QUN...”
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