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J. N. Aoh
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J. N. Aoh
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J. N. Aoh
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1
Bi-axial In-plane Residual Stress Analysis by Combining Moiré Interferometry and Hole-Drilling Method
by
YAN-JIUAN YEH
,
葉炎娟
Published 2007
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2
Study on the Thermosonic Flip Chip Bonding of Chips with Copper Interconnect onto rigid and flex substrate
by
Qing-An Liao
,
廖慶安
Published 2007
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3
The Effect of Mechanical Properties and Grain Characteristics of Metal Film on its Formability during Direct Nanoimprinting
by
Yu-chen Wu
,
巫昱辰
Published 2007
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4
Finite Element Analysis on the Residual Stresses in the Laser Clad Layer Involving Phase Transformation
by
Z.S. Zhang
,
張主聖
Published 2002
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J.N
.
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5
Effect of Blind Hole End Geometry on the Residual Stress Analysis Using Blind Hole-drilling Method
by
Yang Shih Chen
,
陳揚世
Published 2004
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J.N
.
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6
The Study of Wear Characteristics of Cobalt- and Nickel- Based Clad Layer after High Temperature Thermal Fatigue
by
J.C.Chen
,
陳建成
Published 1999
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7
Study of Hot Deformation Behavior and Microstructure of Ti-6Al-4V
by
Jou-Han Lin
,
林宗翰
Published 1999
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J.N
.
Aoh
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8
Residual stress analysis using Moiré interferometry and hole-drilling method
by
H.M.Chen
,
陳浩民
Published 2003
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J.N.Aoh
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9
Study on the Thermosonic Wire Bonding Process for Chips with Copper Intercon-nects under Inert atmosphere
by
S. F. Wu
,
吳勝富
Published 2003
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J
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10
Finite Element Analysis and Experimental Validation on the Laser Cladding with Pre-placed Powder
by
S. J. Liao
,
廖仕傑
Published 2003
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11
Study on the Oxidation Wear Behavior of Laser clad Cobalt- and Nickel- Based Alloys
by
T.C. Hung
,
洪宗奇
Published 2001
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J.N
.
Aoh
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12
Study on the Process Parameters and Bonding Interface of Thermosonic Wire Bonding for Chips with Copper Interconnects
by
R. F. Ding
,
丁榮豐
Published 2001
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13
The Preparation of Fine Grain Gold Film and the Direct Nanoimprinting on Gold Film
by
Zhe-yu Lin
,
林哲宇
Published 2008
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AOH
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14
Study on the Reliability of Thermosonic Flip Chip Bonding of Chips with Copper Interconnects on Flex Substrates
by
Wei-hao chan
,
陳韋豪
Published 2008
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15
FEM Analysis on the Asymmetric Conditions of Steel Slab in the Sizing Press and the Subsequent Horizontal Rolling during Hot Rolling
by
Kun-lin He
,
何昆霖
Published 2008
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