An Overview of AI-Assisted Design-on-Simulation Technology for Reliability Life Prediction of Advanced Packaging

by Sunil Kumar Panigrahy, Yi-Chieh Tseng, Bo-Ruei Lai, Kuo-Ning Chiang
Published 2021-09-01

Thermal Modeling of Temperature Distribution in Metal Additive Manufacturing Considering Effects of Build Layers, Latent Heat, and Temperature-Sensitivity of Material Properties

by Elham Mirkoohi, Jinqiang Ning, Peter Bocchini, Omar Fergani, Kuo-Ning Chiang, Steven Y. Liang
Published 2018-09-01

A Study of Effects of Solder Joint Layout, Geometry and Manufacturing Parameters on the Reliability of Micro-Electronic Devices

by Chang-Ming Liu, 劉昌明
Published 2004

Design and Reliability Analysis of Wafer Level Package with Bubble-Like Buffer Layer

by Chang-Chun Lee, 李昌駿
Published 2002

Using flip chip solder bump in optical passive alignment

by Chen-Yung-Ju, 陳永儒
Published 2002

Research on Self-Alignment Control of Edge Emitting Laser Diode

by Chi-Ming Liao, 廖啟銘
Published 2002

Reliability Analysis of Optical Fiber Array Modulus for Transceiver

by Hsiao-Tung Ku, 顧曉東
Published 2002

Investigation of Electromigration Characteristic in SnAg3.0Cu0.5 Flip Chip Interconnection and the External Mechanical Stress Impact of Al Thin Film

by Chien Chen Lee, 李建成
Published 2008

Design, Analysis and Experiment Validation of Structural Reliability and Microwave Signal Response of Advanced Microsystems Packages

by Chih-Tang Peng, 彭治棠
Published 2005

Analysis and Design of the Nano-Probe Using Large Deflection Theory

by Wei-Chuan Liao, 廖偉全
Published 2004

Investigation of Mechanical Properties of Nano-Scale Metallic Crystal Structural with Point Defects.

by Chao-Jen Huang, 黃昭荏
Published 2007

Investigation of package effect of Si-based piezo-resistive micro pressure sensor

by Chen-Hing Chu, 朱振宏
Published 2006

Investigation of hysteresis phenomenon of Si-based piezo-resistive pressure sensor

by Hsin-Nan Chiang, 蔣信男
Published 2006

Uncertainty and Reliability Analysis of Chip Scale Package Subjected to Board-level Drop Test

by Masafumi Sano, 佐野雅文
Published 2009

Investigation of Nanoscale Single Crystal Group IV-A Mechanical Properties Using Atomistic-Continuum Mechanics (ACM)

by Chun-Te Lin, 林俊德
Published 2006

Process Modeling and Reliability Study of ACA/ACF Type Flip Chip Package

by ChunWen Chang, 張郡文
Published 2000

Investigation of Mechanical Properties of Nano-Scaled Structure Using Atomistic-Continuum Mechanics Method

by Chou Chan-Yen, 周展延
Published 2005

Investigation of Micro Electronic Devices Reliability Using Interfacial Crack Growth Prediction Methodology

by Chang-Chun Lee, 李昌駿
Published 2006

Investigation of Carbon Nanotube Mechanical Properties Using Atomistic-Continuum Mechanics Method

by Chung-Jung Wu, 吳仲融
Published 2006

Study of Effects of Cu Stud Design and IMC Growth on the Reliability of Micro-Electronic Devices

by Kuo-Chin Chang, 張國欽
Published 2003