Showing 1 - 19 results of 19 for search 'Lu wei Hua', query time: 0.14s Refine Results
  1. 1
    The Application of Osborne Checklist in Children's book Illustration
    by LU, WEI HUA, 呂維華
    Published 2017
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  2. 2
    Static and high-rate flexural failure of interleaved carbon/ epoxy composites
    by Lu,Wei Hua, 盧威華
    Published 1995
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  3. 3
    碳纖/環氧樹脂複合材料的撓曲破損
    by LU,WEI-HUA, 盧威華
    Published 1990
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  4. 4
    An Empirical Study on Inequitable Conduct in United States─The Impact of the CAFC Therasense v. Becton en banc Decision
    by Lu, Wei-Hua, 盧威樺
    Published 2012
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  5. 5
    Effects of chip thickness, solder ball shape and underfill dispensing location on plastic strain energy density of corner dot underfilling pattern of chip scale package module.
    by Huang, Chun-Wei, 黃俊維
    Published 2018
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  6. 6
    Effects of chip thickness, solder ball shape and underfill dispensing location on plastic strain energy density of I-shaped underfilling pattern of chip scale package module.
    by Lu, Chun-Hao, 盧浚豪
    Published 2018
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  7. 7
    Effect of chip and molding compound thicknesses on structural stress of multichip module under temperature cycling condition
    by Wu, Chun-Liang, 吳俊良
    Published 2012
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  8. 8
    Effect of die stacking on structural stress of multichip module under temperature cycling condition
    by Liu, Huang-Ju, 劉皇濡
    Published 2012
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  9. 9
    Reliability evaluation and structural stress simulation for temperature cycling and drop tests of the five-chip placement on module
    by KUO, Yi Cheng, 郭益成
    Published 2009
    Other Authors: “...Lu, Wei-Hua...”
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  10. 10
    Adhesion study of the molding compound/chip interface and structural stress simulation for temperature cycling and drop tests of the three-chip on module
    by Liou ,Yi-Cheng, 劉俋呈
    Published 2009
    Other Authors: “...Lu ,Wei-Hua...”
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  11. 11
    Reliability evaluation and structural stress simulation for temperature cycling and drop tests of the five-chip placement on module
    Other Authors: “...Lu, Wei-Hua...”
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  12. 12
    Adhesion study of the molding compound/chip interface and structural stress simulation for temperature cycling and drop tests of the three-chip on module
    Other Authors: “...Lu ,Wei-Hua...”
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  13. 13
    Structural stress simulation and molding compound property measurements of the chip-on-board package
    by Chung ,Yi-Chun, 鍾一駿
    Published 2008
    Other Authors: “...Lu ,Wei-Hua...”
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  14. 14
    Interfacial strength measurements of the chip/molding compound interfaces and structural stress simulation for temperaturing cycling test of the Multi-Chip Module
    by Suen, Wei-Luen, 孫唯倫
    Published 2010
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  15. 15
    Reliability evaluation and structural stress simulation for temperature cycling test of the CSP on module
    by Chen,Shen-Wen, 陳信文
    Published 2010
    Other Authors: “...Lu ,Wei-Hua...”
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  16. 16
    Structural stress simulation of the six-chip on module under temperature cycling and drop test conditions
    by Luo Shao Jie, 羅邵傑
    Published 2013
    Other Authors: “...Lu wei Hua...”
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  17. 17
    Effects of die-shift-distance and molding compound properties on structural stresses in a 5-chip system-in-package under the conditions of molding compound curing process and free falling test
    by Liu, Hui-Chia, 劉蕙嘉
    Published 2016
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  18. 18
    Effects of die thickness and location of Cu pillar bump on structural stresses in a package under the conditions of thermal compression bonding process and temperature cycling.
    by Lin, Jhih-Hao, 林志豪
    Published 2016
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  19. 19
    Effects of die thickness and underfill thickness above chip on structural stresses in an overmold CSP module under the conditions of reflow, underfill curing process, and temperature cycling.
    by Lu, Bo-Ning, 盧柏寧
    Published 2016
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