Showing 1 - 14 results of 14 for search 'Ming-Hwa Jen', query time: 0.10s Refine Results
  1. 1
    Fatigue Fracture and Residual Life of Symmetrically Inclined Double-Edge-Cracked Ti/APC-2 Nano-Composite Laminates
    by Yu-Cheng Liang, 梁育誠
    Published 2019
    Other Authors: “...Ming-Hwa Jen...”
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  2. 2
    Study of V-grooved Microstructural Light Guide Plate
    by Ching-hsiang Chen, 陳慶祥
    Published 2007
    Other Authors: “...Ming-Hwa Jen...”
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  3. 3
    Study on Electromigration of Flip-Chip Solder Interconnect
    by Hsiung-Nien Huang, 黃雄年
    Published 2004
    Other Authors: “...Ming-Hwa Jen...”
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  4. 4
    Reliability of Wafer-Level CSP Under Cyclic Bending Test
    by Han-Hui Tsai, 蔡翰輝
    Published 2004
    Other Authors: “...Ming-Hwa Jen...”
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  5. 5
    Study of Electromigration in Micro SnAg Stripe by theApplication of the Infrared
    by Yi-Tian Jhan, 詹益添
    Published 2013
    Other Authors: “...Ming-Hwa Jen...”
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  6. 6
    Fatigue Fracture and Mechanical Properties of Single-Edged Cracks in Ti/APC-2 Hybrid Nano-Composite Laminates
    by Bo-Cyuan Lin, 林柏全
    Published 2012
    Other Authors: “...Ming-Hwa Jen...”
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  7. 7
    Numerical Analysis of Residual Strength in AS-4/PEEK Composite Laminates
    by Chin-Fa Lee, 李進發
    Published 2001
    Other Authors: “...Ming-Hwa Jen...”
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  8. 8
    The Experimental Investingation of Residual Strength and Stiffness in Carbon/PEEK APC-2 Composite Laminates
    by Chang-He Wu, 吳長和
    Published 2001
    Other Authors: “...Ming-Hwa Jen...”
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  9. 9
    Thermal Stress Analysis of Flip Chip in CSP
    by Shiao-Chian Yeh, 葉曉謙
    Published 2001
    Other Authors: “...Ming-Hwa Jen...”
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  10. 10
    Structural response of package-level solder balls due to high-speed impact test
    by Shih-cyuan Chen, 陳仕權
    Published 2006
    Other Authors: “...Ming-hwa Jen...”
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  11. 11
    新型夾具應用於複材單疊混合接頭之機械性能探討
    by WEI-HWANG LIN, 林偉煌
    Published 1999
    Other Authors: “...MING-HWA JEN...”
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  12. 12
    Numerical Analysis of Ti/PC/APC-2/Kevlar Hybrid Composite Laminates after High-Velocity Impact
    by Shang-peng Chen, 陳尚鵬
    Published 2014
    Other Authors: “...Ming-Hwa Jen...”
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  13. 13
    Study of Integration Technology for Stacking Package
    by Ming-Hsiang Cheng, 鄭明祥
    Published 2007
    Other Authors: “...Ming-Hwa Jen...”
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  14. 14
    Redistribution in WLCSP- Design and Fabrication
    by Chia-yi Hu, 胡家羿
    Published 2007
    Other Authors: “...Ming-Hwa Jen...”
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