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Thaiping Chen
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Thaiping Chen
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Thaiping Chen
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1
Optimal Interface Strength of Lead Free Solder Ball to IC Package Subjected to High Thermal Loading and Electromigration
by
Lin, Yu-Min
,
林昱旻
Published 2010
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Thaiping
Chen
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2
The Micro-Pattern Design in LED’s Packages
by
Yan-Huei Li
,
李彥輝
Published 2007
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...
Thaiping
Chen
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3
The study on reliability and optimization of IC package in temperature shack conditions of interface strength by the fuzzy logic in taguchi technique
by
Ting-Xuan Su
,
蘇廷軒
Published 2008
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Thaiping
Chen
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4
The Study of Optical Characterstic on LCD Light Guide Plate Subjected to Thermal Warpage
by
Tsu-Lin Tsay
,
蔡智霖
Published 2009
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Thaiping
Chen
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5
The Study of Shear Force for Lead Free Solder Ball to IC Package Subjected to the Cyclic Thermal Loading
by
Po-Han Su
,
蘇柏瀚
Published 2010
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Thaiping
Chen
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6
Optimal Design Aluminum Alloy Dissimlar Joints Welding in Friction Stir Welding Manufactuting Process
by
Hsu-Hsuan Cheng
,
鄭旭軒
Published 2014
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Thaiping
Chen
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