Microstructure and Fabrication of Cu-Pb-Sn/Q235 Laminated Composite by Semi-Solid Rolling
In the present work, Cu-Pb-Sn and Q235 laminated composite were fabricated by a horizontal semisolid rolling procedure. The interfacial structure, elemental distribution, and properties of the composite were investigated. Finite-element simulation was conducted to analyze the temperature field and s...
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doaj-0a62e74716d94836b1b044ab19da9e492020-11-24T22:03:06ZengMDPI AGMetals2075-47012018-09-018972210.3390/met8090722met8090722Microstructure and Fabrication of Cu-Pb-Sn/Q235 Laminated Composite by Semi-Solid RollingYubo Zhang0Jiaming Liu1Ying Fu2Jinchuan Jie3Yiping Lu4Qingtao Guo5Tongmin Wang6Tingju Li7Key Laboratory of Solidification Control and Digital Preparation Technology (Liaoning Province), School of Materials Science and Engineering, Dalian University of Technology, Dalian 116024, ChinaKey Laboratory of Solidification Control and Digital Preparation Technology (Liaoning Province), School of Materials Science and Engineering, Dalian University of Technology, Dalian 116024, ChinaEngineering Institute, Bohai University, Jinzhou 121001, ChinaKey Laboratory of Solidification Control and Digital Preparation Technology (Liaoning Province), School of Materials Science and Engineering, Dalian University of Technology, Dalian 116024, ChinaKey Laboratory of Solidification Control and Digital Preparation Technology (Liaoning Province), School of Materials Science and Engineering, Dalian University of Technology, Dalian 116024, ChinaState Key Laboratory of Metal Material for Marine Equipment and Application, Anshan 114000, ChinaKey Laboratory of Solidification Control and Digital Preparation Technology (Liaoning Province), School of Materials Science and Engineering, Dalian University of Technology, Dalian 116024, ChinaKey Laboratory of Solidification Control and Digital Preparation Technology (Liaoning Province), School of Materials Science and Engineering, Dalian University of Technology, Dalian 116024, ChinaIn the present work, Cu-Pb-Sn and Q235 laminated composite were fabricated by a horizontal semisolid rolling procedure. The interfacial structure, elemental distribution, and properties of the composite were investigated. Finite-element simulation was conducted to analyze the temperature field and solidification process during the semisolid rolling. An appropriate semi-solid region was observed at a pouring temperature of 1598 K in the simulation, which would effectively kept fluidity and avoided casting defects. The experimental results showed that good interface between Cu-Pb-Sn alloy and Q235 steel was achieved by the proposed process at 1598 K, without casting defects or excessive deformation. The Cu and Fe alloys were bonded mainly by the diffusion of Fe into Cu matrix, and a handful of microscopic Pb-rich layer. Fine Pb-rich precipitates were uniformly distributed in the Cu-Pb-Sn alloy, and were considered to be advantageous to the self-lubrication property. The average tensile-shear strength of the interface was higher than 57.68 MPa at a pouring temperature of 1598 K, which fulfilled the requirements for a further extrusion process.http://www.mdpi.com/2075-4701/8/9/722laminated compositeCu-Pb-Sn alloysemi-solid rollinginterface |
collection |
DOAJ |
language |
English |
format |
Article |
sources |
DOAJ |
author |
Yubo Zhang Jiaming Liu Ying Fu Jinchuan Jie Yiping Lu Qingtao Guo Tongmin Wang Tingju Li |
spellingShingle |
Yubo Zhang Jiaming Liu Ying Fu Jinchuan Jie Yiping Lu Qingtao Guo Tongmin Wang Tingju Li Microstructure and Fabrication of Cu-Pb-Sn/Q235 Laminated Composite by Semi-Solid Rolling Metals laminated composite Cu-Pb-Sn alloy semi-solid rolling interface |
author_facet |
Yubo Zhang Jiaming Liu Ying Fu Jinchuan Jie Yiping Lu Qingtao Guo Tongmin Wang Tingju Li |
author_sort |
Yubo Zhang |
title |
Microstructure and Fabrication of Cu-Pb-Sn/Q235 Laminated Composite by Semi-Solid Rolling |
title_short |
Microstructure and Fabrication of Cu-Pb-Sn/Q235 Laminated Composite by Semi-Solid Rolling |
title_full |
Microstructure and Fabrication of Cu-Pb-Sn/Q235 Laminated Composite by Semi-Solid Rolling |
title_fullStr |
Microstructure and Fabrication of Cu-Pb-Sn/Q235 Laminated Composite by Semi-Solid Rolling |
title_full_unstemmed |
Microstructure and Fabrication of Cu-Pb-Sn/Q235 Laminated Composite by Semi-Solid Rolling |
title_sort |
microstructure and fabrication of cu-pb-sn/q235 laminated composite by semi-solid rolling |
publisher |
MDPI AG |
series |
Metals |
issn |
2075-4701 |
publishDate |
2018-09-01 |
description |
In the present work, Cu-Pb-Sn and Q235 laminated composite were fabricated by a horizontal semisolid rolling procedure. The interfacial structure, elemental distribution, and properties of the composite were investigated. Finite-element simulation was conducted to analyze the temperature field and solidification process during the semisolid rolling. An appropriate semi-solid region was observed at a pouring temperature of 1598 K in the simulation, which would effectively kept fluidity and avoided casting defects. The experimental results showed that good interface between Cu-Pb-Sn alloy and Q235 steel was achieved by the proposed process at 1598 K, without casting defects or excessive deformation. The Cu and Fe alloys were bonded mainly by the diffusion of Fe into Cu matrix, and a handful of microscopic Pb-rich layer. Fine Pb-rich precipitates were uniformly distributed in the Cu-Pb-Sn alloy, and were considered to be advantageous to the self-lubrication property. The average tensile-shear strength of the interface was higher than 57.68 MPa at a pouring temperature of 1598 K, which fulfilled the requirements for a further extrusion process. |
topic |
laminated composite Cu-Pb-Sn alloy semi-solid rolling interface |
url |
http://www.mdpi.com/2075-4701/8/9/722 |
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