Microstructure and Fabrication of Cu-Pb-Sn/Q235 Laminated Composite by Semi-Solid Rolling

• Main Authors: Yubo Zhang, Jiaming Liu, Ying Fu, Jinchuan Jie, Yiping Lu, Qingtao Guo, Tongmin Wang, Tingju Li
• Format: Article
• Language: English
• Published: MDPI AG 2018-09-01
• Series: Metals
• Subjects: laminated composite; Cu-Pb-Sn alloy; semi-solid rolling; interface
• Online Access: http://www.mdpi.com/2075-4701/8/9/722

In the present work, Cu-Pb-Sn and Q235 laminated composite were fabricated by a horizontal semisolid rolling procedure. The interfacial structure, elemental distribution, and properties of the composite were investigated. Finite-element simulation was conducted to analyze the temperature field and solidification process during the semisolid rolling. An appropriate semi-solid region was observed at a pouring temperature of 1598 K in the simulation, which would effectively kept fluidity and avoided casting defects. The experimental results showed that good interface between Cu-Pb-Sn alloy and Q235 steel was achieved by the proposed process at 1598 K, without casting defects or excessive deformation. The Cu and Fe alloys were bonded mainly by the diffusion of Fe into Cu matrix, and a handful of microscopic Pb-rich layer. Fine Pb-rich precipitates were uniformly distributed in the Cu-Pb-Sn alloy, and were considered to be advantageous to the self-lubrication property. The average tensile-shear strength of the interface was higher than 57.68 MPa at a pouring temperature of 1598 K, which fulfilled the requirements for a further extrusion process.