Hot Deformation Behavior of Cu–Sn–La Polycrystalline Alloy Prepared by Upcasting
<b> </b>In this study, the hot deformation of a Cu–0.55Sn–0.08La (wt.%) alloy was studied using a Gleeble-3180 testing machine at deformation temperatures of 400–700 °C and various strain rates. The stress–strain curve showed that the hot deformation behavior of the Cu–0.55Sn–0.08La (wt....
Main Authors: | Siming Hua, Pingze Zhang, Zili Liu, Lin Yang |
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Format: | Article |
Language: | English |
Published: |
MDPI AG
2020-08-01
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Series: | Materials |
Subjects: | |
Online Access: | https://www.mdpi.com/1996-1944/13/17/3739 |
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