Scratching Cu|Au Nanolaminates

Scratching Cu|Au Nanolaminates

We used molecular dynamics simulations to study the scratching of Cu|Au nanolaminates of 5 nm layer thickness with a nanoscale indenter of 15 nm radius at normal forces between <inline-formula> <math display="inline"> <semantics> <mrow> <mn>0.5</mn> <...

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Bibliographic Details
Main Authors: Adrien Gola, Lars Pastewka
Format: Article
Language:English
Published: MDPI AG 2019-05-01
Series:Lubricants
Subjects:
metals
multilayers
nanolaminates
tribology
scratching
molecular dynamics simulations
Online Access:https://www.mdpi.com/2075-4442/7/5/44
Description
Summary:We used molecular dynamics simulations to study the scratching of Cu|Au nanolaminates of 5 nm layer thickness with a nanoscale indenter of 15 nm radius at normal forces between <inline-formula> <math display="inline"> <semantics> <mrow> <mn>0.5</mn> <mspace width="3.33333pt"></mspace> <mi mathvariant="sans-serif">&#956;</mi> </mrow> </semantics> </math> </inline-formula>N and <inline-formula> <math display="inline"> <semantics> <mrow> <mn>2</mn> <mspace width="3.33333pt"></mspace> <mi mathvariant="sans-serif">&#956;</mi> </mrow> </semantics> </math> </inline-formula>N. Our simulations show that Au layers wear quickly while Cu layers are more resistant to wear. Plowing was accompanied by the roughening of the Cu|Au heterointerface that lead to the folding of the nanolaminate structure at the edge of the wear track. Our explorative simulations hint at the complex deformation processes occurring in nanolaminates under tribological load.
ISSN:2075-4442

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