ELECTRODEPOSITION OF SOLDER BUMP TO SEMICONDUCTOR DEVICES

ELECTRODEPOSITION OF SOLDER BUMP TO SEMICONDUCTOR DEVICES

Using nonstationary regimes electrolysis for electrodepositing silver solder bump semiconductor blocked has reduced lateral expansion of different height on the plate, to improve the qualitative characteristics of the product, increase the number of devices produced on a semiconductor wafer, and the...

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Main Authors: A. A. Khmyl, I. I. Kuzmar, L. K. Kushner, N. V. Bogush, M. M. Borisik, S. M. Zavadski
Format: Article
Language:Russian
Published: Educational institution «Belarusian State University of Informatics and Radioelectronics» 2019-06-01
Series:Doklady Belorusskogo gosudarstvennogo universiteta informatiki i radioèlektroniki
Subjects:
серебряные электрохимические покрытия
нестационарный электролиз
объемные (столбиковые) выводы
Online Access:https://doklady.bsuir.by/jour/article/view/248
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spelling doaj-17d0d1032ab0463c8d49b363a416a7422021-07-28T16:19:47ZrusEducational institution «Belarusian State University of Informatics and Radioelectronics»Doklady Belorusskogo gosudarstvennogo universiteta informatiki i radioèlektroniki1729-76482019-06-01081622247ELECTRODEPOSITION OF SOLDER BUMP TO SEMICONDUCTOR DEVICESA. A. Khmyl0I. I. Kuzmar1L. K. Kushner2N. V. Bogush3M. M. Borisik4S. M. Zavadski5Белорусский государственный университет информатики и радиоэлектроникиБелорусский государственный университет информатики и радиоэлектроникиБелорусский государственный университет информатики и радиоэлектроникиБелорусский государственный университет информатики и радиоэлектроникиБелорусский государственный университет информатики и радиоэлектроникиБелорусский государственный университет информатики и радиоэлектроникиUsing nonstationary regimes electrolysis for electrodepositing silver solder bump semiconductor blocked has reduced lateral expansion of different height on the plate, to improve the qualitative characteristics of the product, increase the number of devices produced on a semiconductor wafer, and thereby improve process performance and achieve economies of precious metals.https://doklady.bsuir.by/jour/article/view/248серебряные электрохимические покрытиянестационарный электролизобъемные (столбиковые) выводы
collection DOAJ
language Russian
format Article
sources DOAJ
author A. A. Khmyl
I. I. Kuzmar
L. K. Kushner
N. V. Bogush
M. M. Borisik
S. M. Zavadski
spellingShingle A. A. Khmyl
I. I. Kuzmar
L. K. Kushner
N. V. Bogush
M. M. Borisik
S. M. Zavadski
ELECTRODEPOSITION OF SOLDER BUMP TO SEMICONDUCTOR DEVICES
Doklady Belorusskogo gosudarstvennogo universiteta informatiki i radioèlektroniki
серебряные электрохимические покрытия
нестационарный электролиз
объемные (столбиковые) выводы
author_facet A. A. Khmyl
I. I. Kuzmar
L. K. Kushner
N. V. Bogush
M. M. Borisik
S. M. Zavadski
author_sort A. A. Khmyl
title ELECTRODEPOSITION OF SOLDER BUMP TO SEMICONDUCTOR DEVICES
title_short ELECTRODEPOSITION OF SOLDER BUMP TO SEMICONDUCTOR DEVICES
title_full ELECTRODEPOSITION OF SOLDER BUMP TO SEMICONDUCTOR DEVICES
title_fullStr ELECTRODEPOSITION OF SOLDER BUMP TO SEMICONDUCTOR DEVICES
title_full_unstemmed ELECTRODEPOSITION OF SOLDER BUMP TO SEMICONDUCTOR DEVICES
title_sort electrodeposition of solder bump to semiconductor devices
publisher Educational institution «Belarusian State University of Informatics and Radioelectronics»
series Doklady Belorusskogo gosudarstvennogo universiteta informatiki i radioèlektroniki
issn 1729-7648
publishDate 2019-06-01
description Using nonstationary regimes electrolysis for electrodepositing silver solder bump semiconductor blocked has reduced lateral expansion of different height on the plate, to improve the qualitative characteristics of the product, increase the number of devices produced on a semiconductor wafer, and thereby improve process performance and achieve economies of precious metals.
topic серебряные электрохимические покрытия
нестационарный электролиз
объемные (столбиковые) выводы
url https://doklady.bsuir.by/jour/article/view/248
work_keys_str_mv AT aakhmyl electrodepositionofsolderbumptosemiconductordevices
AT iikuzmar electrodepositionofsolderbumptosemiconductordevices
AT lkkushner electrodepositionofsolderbumptosemiconductordevices
AT nvbogush electrodepositionofsolderbumptosemiconductordevices
AT mmborisik electrodepositionofsolderbumptosemiconductordevices
AT smzavadski electrodepositionofsolderbumptosemiconductordevices
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