Application of Multi-Descriptor Binary Shape Analysis for Classification of Electronic Parts

Rapid growth of availability of modern electronic and robotic solutions, also for home and amateur use, related to the progress in home automation and popularity of the IoT systems, makes it possible to develop some unique hardware solutions, also by independent researchers and engineers, often with...

Full description

Bibliographic Details
Main Authors: Kamil Maliński, Krzysztof Okarma
Format: Article
Language:English
Published: Graz University of Technology 2020-04-01
Series:Journal of Universal Computer Science
Subjects:
Online Access:https://lib.jucs.org/article/24010/download/pdf/
id doaj-18f4fa9310ab4db387911a7261b32b67
record_format Article
spelling doaj-18f4fa9310ab4db387911a7261b32b672021-09-28T14:07:15ZengGraz University of TechnologyJournal of Universal Computer Science0948-69682020-04-0126447949510.3897/jucs.2020.02524010Application of Multi-Descriptor Binary Shape Analysis for Classification of Electronic PartsKamil Maliński0Krzysztof Okarma1West Pomeranian University of Technology in SzczecinWest Pomeranian University of TechnologyRapid growth of availability of modern electronic and robotic solutions, also for home and amateur use, related to the progress in home automation and popularity of the IoT systems, makes it possible to develop some unique hardware solutions, also by independent researchers and engineers, often with the help of the 3D printing technology. Although in many industrial applications high speed pick and place machines are used for assembling small surface-mount devices (SMD), especially in mass production of electronic parts, there are still some applications, where the traditional through-hole technology used in Printed Circuit Boards (PCB) is utilised, particularly considering some mechanical, thermal or power conditions, preventing the use of the SMD technology. One of the possibilities of supporting such types of production and prototyping, in some cases supported by relatively less sophisticated robotic solutions, may be the application of vision systems, making it possible to classify and recognize some electronics parts with the use of shape analysis of their packages as well as further optical recognition of markings. Another application of such methods may be related to the automatic vision based verification of the assembling quality and correctness of the placement of electronic parts after completing the production. In the paper some experimental results, obtained using various shape descriptors for the classification of electronic packages, are presented. The initial experiments, obtained for a prepared dedicated database of synthetic images, have been verified and confirmed also for some natural images, leading to promising results.https://lib.jucs.org/article/24010/download/pdf/shape analysiselectronic packagesimage feature
collection DOAJ
language English
format Article
sources DOAJ
author Kamil Maliński
Krzysztof Okarma
spellingShingle Kamil Maliński
Krzysztof Okarma
Application of Multi-Descriptor Binary Shape Analysis for Classification of Electronic Parts
Journal of Universal Computer Science
shape analysis
electronic packages
image feature
author_facet Kamil Maliński
Krzysztof Okarma
author_sort Kamil Maliński
title Application of Multi-Descriptor Binary Shape Analysis for Classification of Electronic Parts
title_short Application of Multi-Descriptor Binary Shape Analysis for Classification of Electronic Parts
title_full Application of Multi-Descriptor Binary Shape Analysis for Classification of Electronic Parts
title_fullStr Application of Multi-Descriptor Binary Shape Analysis for Classification of Electronic Parts
title_full_unstemmed Application of Multi-Descriptor Binary Shape Analysis for Classification of Electronic Parts
title_sort application of multi-descriptor binary shape analysis for classification of electronic parts
publisher Graz University of Technology
series Journal of Universal Computer Science
issn 0948-6968
publishDate 2020-04-01
description Rapid growth of availability of modern electronic and robotic solutions, also for home and amateur use, related to the progress in home automation and popularity of the IoT systems, makes it possible to develop some unique hardware solutions, also by independent researchers and engineers, often with the help of the 3D printing technology. Although in many industrial applications high speed pick and place machines are used for assembling small surface-mount devices (SMD), especially in mass production of electronic parts, there are still some applications, where the traditional through-hole technology used in Printed Circuit Boards (PCB) is utilised, particularly considering some mechanical, thermal or power conditions, preventing the use of the SMD technology. One of the possibilities of supporting such types of production and prototyping, in some cases supported by relatively less sophisticated robotic solutions, may be the application of vision systems, making it possible to classify and recognize some electronics parts with the use of shape analysis of their packages as well as further optical recognition of markings. Another application of such methods may be related to the automatic vision based verification of the assembling quality and correctness of the placement of electronic parts after completing the production. In the paper some experimental results, obtained using various shape descriptors for the classification of electronic packages, are presented. The initial experiments, obtained for a prepared dedicated database of synthetic images, have been verified and confirmed also for some natural images, leading to promising results.
topic shape analysis
electronic packages
image feature
url https://lib.jucs.org/article/24010/download/pdf/
work_keys_str_mv AT kamilmalinski applicationofmultidescriptorbinaryshapeanalysisforclassificationofelectronicparts
AT krzysztofokarma applicationofmultidescriptorbinaryshapeanalysisforclassificationofelectronicparts
_version_ 1716865847878746112