Effect of temperature on the electrodeposition of disperse copper deposits
The effect of temperature on the electrodeposition of copper at overpotentials belonging to the plateau of the limiting diffusion current density and higher was examined by the determination of the average current efficiency of hydrogen evolution and by scanning electron microscopic (SEM) analysis o...
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Serbian Chemical Society
2007-01-01
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doaj-194756effb2e411d847ea3182457a6702020-12-24T14:33:13ZengSerbian Chemical Society Journal of the Serbian Chemical Society0352-51391820-74212007-01-0172121369138110.2298/JSC0712369N0352-51390712369NEffect of temperature on the electrodeposition of disperse copper depositsNikolić Nebojša D.0Pavlović Ljubica J.1Pavlović Miomir G.2Popov Konstantin I.3IHTM - Centar za elektrohemiju, BeogradIHTM - Centar za elektrohemiju, BeogradIHTM - Centar za elektrohemiju, BeogradIHTM - Centar za elektrohemiju, Beograd + Tehnološko-metalurški fakultet, BeogradThe effect of temperature on the electrodeposition of copper at overpotentials belonging to the plateau of the limiting diffusion current density and higher was examined by the determination of the average current efficiency of hydrogen evolution and by scanning electron microscopic (SEM) analysis of the morphology of the formed copper deposits. Increasing the temperature of the solution led to a shift of both the beginning and the end of the plateau of the limiting diffusion current density towards lower electrodeposition overpotentials. Also, higher temperatures led to the formation of morphological forms of copper deposits characteristic for electrodeposition of copper at some higher overpotentials. The unexpected trend in the development of copper structures electrodeposited at an overpotential of 800 mV is discussed in terms of the effect of temperature on the viscosity and surface tension of the electroplating solution.http://www.doiserbia.nb.rs/img/doi/0352-5139/2007/0352-51390712369N.pdfelectrodepositioncopperhydrogen evolutiontemperatureviscositysurface tension |
collection |
DOAJ |
language |
English |
format |
Article |
sources |
DOAJ |
author |
Nikolić Nebojša D. Pavlović Ljubica J. Pavlović Miomir G. Popov Konstantin I. |
spellingShingle |
Nikolić Nebojša D. Pavlović Ljubica J. Pavlović Miomir G. Popov Konstantin I. Effect of temperature on the electrodeposition of disperse copper deposits Journal of the Serbian Chemical Society electrodeposition copper hydrogen evolution temperature viscosity surface tension |
author_facet |
Nikolić Nebojša D. Pavlović Ljubica J. Pavlović Miomir G. Popov Konstantin I. |
author_sort |
Nikolić Nebojša D. |
title |
Effect of temperature on the electrodeposition of disperse copper deposits |
title_short |
Effect of temperature on the electrodeposition of disperse copper deposits |
title_full |
Effect of temperature on the electrodeposition of disperse copper deposits |
title_fullStr |
Effect of temperature on the electrodeposition of disperse copper deposits |
title_full_unstemmed |
Effect of temperature on the electrodeposition of disperse copper deposits |
title_sort |
effect of temperature on the electrodeposition of disperse copper deposits |
publisher |
Serbian Chemical Society |
series |
Journal of the Serbian Chemical Society |
issn |
0352-5139 1820-7421 |
publishDate |
2007-01-01 |
description |
The effect of temperature on the electrodeposition of copper at overpotentials belonging to the plateau of the limiting diffusion current density and higher was examined by the determination of the average current efficiency of hydrogen evolution and by scanning electron microscopic (SEM) analysis of the morphology of the formed copper deposits. Increasing the temperature of the solution led to a shift of both the beginning and the end of the plateau of the limiting diffusion current density towards lower electrodeposition overpotentials. Also, higher temperatures led to the formation of morphological forms of copper deposits characteristic for electrodeposition of copper at some higher overpotentials. The unexpected trend in the development of copper structures electrodeposited at an overpotential of 800 mV is discussed in terms of the effect of temperature on the viscosity and surface tension of the electroplating solution. |
topic |
electrodeposition copper hydrogen evolution temperature viscosity surface tension |
url |
http://www.doiserbia.nb.rs/img/doi/0352-5139/2007/0352-51390712369N.pdf |
work_keys_str_mv |
AT nikolicnebojsad effectoftemperatureontheelectrodepositionofdispersecopperdeposits AT pavlovicljubicaj effectoftemperatureontheelectrodepositionofdispersecopperdeposits AT pavlovicmiomirg effectoftemperatureontheelectrodepositionofdispersecopperdeposits AT popovkonstantini effectoftemperatureontheelectrodepositionofdispersecopperdeposits |
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