The Fourth Bioelectronic Medicine Summit “Technology Targeting Molecular Mechanisms”: current progress, challenges, and charting the future

Abstract There is a broad and growing interest in Bioelectronic Medicine, a dynamic field that continues to generate new approaches in disease treatment. The fourth bioelectronic medicine summit “Technology targeting molecular mechanisms” took place on September 23 and 24, 2020. This virtual meeting...

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Main Authors: Timir Datta-Chaudhuri, Theodoros Zanos, Eric H. Chang, Peder S. Olofsson, Stephan Bickel, Chad Bouton, Daniel Grande, Loren Rieth, Cynthia Aranow, Ona Bloom, Ashesh D. Mehta, Gene Civillico, Molly M. Stevens, Eric Głowacki, Christopher Bettinger, Martin Schüettler, Chris Puleo, Robert Rennaker, Saroj Mohanta, Daniela Carnevale, Silvia V. Conde, Bruno Bonaz, David Chernoff, Suraj Kapa, Magnus Berggren, Kip Ludwig, Stavros Zanos, Larry Miller, Doug Weber, Daniel Yoshor, Lawrence Steinman, Sangeeta S. Chavan, Valentin A. Pavlov, Yousef Al-Abed, Kevin J. Tracey
Format: Article
Language:English
Published: BMC 2021-05-01
Series:Bioelectronic Medicine
Subjects:
Online Access:https://doi.org/10.1186/s42234-021-00068-6
Description
Summary:Abstract There is a broad and growing interest in Bioelectronic Medicine, a dynamic field that continues to generate new approaches in disease treatment. The fourth bioelectronic medicine summit “Technology targeting molecular mechanisms” took place on September 23 and 24, 2020. This virtual meeting was hosted by the Feinstein Institutes for Medical Research, Northwell Health. The summit called international attention to Bioelectronic Medicine as a platform for new developments in science, technology, and healthcare. The meeting was an arena for exchanging new ideas and seeding potential collaborations involving teams in academia and industry. The summit provided a forum for leaders in the field to discuss current progress, challenges, and future developments in Bioelectronic Medicine. The main topics discussed at the summit are outlined here.
ISSN:2332-8886