Optimization of a Wavy Microchannel Heat Sink with Grooves
In this study, a wavy microchannel heat sink with grooves using water as the working fluid is proposed for application to cooling microprocessors. The geometry of the heat sink was optimized to improve heat transfer and pressure loss simultaneously. To achieve optimization goals, the average frictio...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2021-02-01
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| Series: | Processes |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2227-9717/9/2/373 |