Isolation of kinetic and spatial properties of uni-axial dynamic tensile loading of OFHC copper

Materials performance is recognized as being central to many emergent technologies. Future technologies will place increasing demands on materials performance with respect to extremes in stress, strain, temperature, and pressure. In this study, the dynamic ductile damage evolution of OFHC Cu is expl...

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Bibliographic Details
Main Authors: Mourad H., Lebensohn R., Hansen B., Bronkhorst C.A., Cerreta E.K., Escobedo-Diaz J.P., Dennis-Koller D., Patterson B., Tonks D.
Format: Article
Language:English
Published: EDP Sciences 2012-08-01
Series:EPJ Web of Conferences
Online Access:http://dx.doi.org/10.1051/epjconf/20122601040

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