Reliability Considerations of Flip Chip Components for Automotive Electronic Applications

Reliability Considerations of Flip Chip Components for Automotive Electronic Applications

Bibliographic Details
Main Authors:	Iwao Tachikawa, Naoharu Tsuzimoto, Isao Bansaku, Keisuke Sugiyama
Format:	Article
Language:	English
Published:	Hindawi Limited 1981-01-01
Series:	Active and Passive Electronic Components
Online Access:	http://dx.doi.org/10.1155/APEC.9.87

Similar Items

Reliability analysis of flip chip package
by: Jia-Shan Lee, et al.
Published: (2004)

Investigation of the reliability for the Flip-Chip Package
by: Zi-PengWu, et al.
Published: (2010)

Flip Chip Underfill Evaluation, Reliability and Failure Analysis
by: Jim_Lin, et al.
Published: (2001)

Design and Reliability Analysis of No-Underfill Flip Chip Package
by: Zhen nan Liu, et al.
Published: (2000)

Chip package interaction (CPI) and its impact on the reliability of flip-chip packages
by: Zhang, Xuefeng
Published: (2010)

Underfill Process Optimization for Assembly of Flip Chip Components
by: Chung-Jen Chen, et al.
Published: (2004)

Investigation of electromigration reliability of solder joint in flip-chip packages
by: Ding, Min, 1975-
Published: (2008)

Material Property of Underfill and Reliability Analysis in Flip Chip Package
by: Chia-Yu Tsai, et al.
Published: (2002)

Reliability of Flip Chip-Plastic Ball Grid Array Package
by: Chen-JungWong, et al.
Published: (2012)

Reliability Enhancement of Flip-Chip GaN-based HEMTs
by: Hsu, Chien-Pin, et al.
Published: (2013)

Investigation of the Reliability in Thermally Enhanced Flip Chip PBGA Packages
by: Tien-PeiLiu, et al.
Published: (2011)

Reliability Studies of Novel Underfill Materials for Flip-chip Packaging
by: 徐元辰
Published: (2006)

Design and Reliability Analysis of Wafer Level/Flip Chip Packages
by: Yungte Lin, et al.
Published: (2000)

Reliability Analyses of Flip Chip Assembly with Micro-Solder Balls
by: Wen-Hua Chang, et al.
Published: (2013)

Electromigration and chip-package interaction reliability of flip chip packages with Cu pillar bumps
by: Wang, Yiwei
Published: (2012)

Study on the Reliability of Thermosonic Flip Chip Bonding of Chips with Copper Interconnects on Flex Substrates
by: Wei-hao chan, et al.
Published: (2008)

Flip chip on flex for low cost electronics assembly
by: Venton, Jennifer Lynne
Published: (2007)

Investigation of Electromigration Reliability of Flip-chip Packages by Electrothermal Coupling Analysis
by: Chin-LiKao, et al.
Published: (2018)

Effect of Joule Heating on Electromigration Reliability in Flip Chip Solder Joints
by: 邱聖翔
Published: (2007)

System Level Reliability Test of Flip Chip BGA -Power Cycling
by: 施建華
Published: (2009)

An Analysis on Thermal Characterization and Reliability of High Frequency Flip-Chip Package
by: Wei-Min Li, et al.
Published: (2008)

Investigation of GaN-Based Flip-Chip LEDs in Brightness and Reliability
by: Wei-Shou Chen, et al.
Published: (2008)

Reliability Analysis of Non-Clean Flux to Flip Chip Bond Process
by: Yi-dao Wang, et al.
Published: (2016)

Probabilistic Design and Reliability Analysis of Flip-Chip Chip Scale Packages under Accelerated Environmental Conditions
by: Chih-Yen Su, et al.
Published: (2012)

Predictive Failure Model for Flip Chip on Board Component Level Assemblies
by: Muncy, Jennifer V.
Published: (2005)

Study on the Nanocomposite Underfill for Flip-Chip Application
by: Sun, Yangyang
Published: (2007)

Micrometallurgy in the electroplated bumps for flip-chip applications.
Published: (2004)

The correlation of underfill and non-clean flux in flip chip package and reliability test
by: Pei-Yu Hsu, et al.

A Reliability Analysis of the Flip Chip Joint under Cyclic Thermomechanical Loading
by: 羅一元, et al.
Published: (1999)

Effects of Underfills on Gold-to-Gold Reliability for High Frequency Flip-Chip Packaging
by: Po-Chun, Liu, et al.

Process Modeling and Reliability Study of ACA/ACF Type Flip Chip Package
by: ChunWen Chang, et al.
Published: (2000)

Research on the Underfill Filler Particles for Reliability of Flip-Chip Solder Interconnects by Micromechanical
by: 鍾培原
Published: (2001)

Fatigue Life of Flip-Chip Package and Reliability Evaluation of Lead-Free Solder
by: Chien-Chia Chiu, et al.
Published: (2004)

Reliability Study of a Flip Chip Type CMOS Image Sensor Package
by: Liang-Tien Lu, et al.
Published: (2005)

Effect of Electronic Package Design on the Thermal Stress in Flip Chip Process
by: XING-JUE DENG, et al.
Published: (2008)

A Suitability Study for the Shear and Bend Tests as substitutions for Thermal Cycling Reliability Test of Flip Chip Ball Grid Array Components
by: Chen-Tse Fan, et al.
Published: (2008)

reilability of flip-chip package
by: Kun-Ru Tsai, et al.
Published: (2006)

Epoxy Molding Compound for Flip Chip Package Strip Warpage Evaluation and Reliability Analysis
by: LIU,YUN-YUEH, et al.
Published: (2019)

Epoxy Molding Compound For Flip Chip Device Internal Void Improvement And Reliability Analysis
by: Hong, YU-SHUN, et al.
Published: (2018)

Reliability Analysis of 2.5D Structure and Flip Chip Die Stacking Packaging
by: Kuan-ChiehHuang, et al.
Published: (2018)