Next Generation Ceramic Substrate Fabricated at Room Temperature
Abstract A ceramic substrate must not only have an excellent thermal performance but also be thin, since the electronic devices have to become thin and small in the electronics industry of the next generation. In this manuscript, a thin ceramic substrate (thickness: 30–70 µm) is reported for the nex...
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doaj-267d64098a644d6c8946ea847e54558d2020-12-08T01:35:23ZengNature Publishing GroupScientific Reports2045-23222017-07-017111010.1038/s41598-017-06774-zNext Generation Ceramic Substrate Fabricated at Room TemperatureYuna Kim0Cheol-Woo Ahn1Jong-Jin Choi2Jungho Ryu3Jong-Woo Kim4Woon-Ha Yoon5Dong-Soo Park6Seog-Young Yoon7Byungjin Ma8Byung-Dong Hahn9Functional Ceramics Department, Korea Institute of Materials Science, 797 Changwon-daero, Seongsan-guFunctional Ceramics Department, Korea Institute of Materials Science, 797 Changwon-daero, Seongsan-guFunctional Ceramics Department, Korea Institute of Materials Science, 797 Changwon-daero, Seongsan-guFunctional Ceramics Department, Korea Institute of Materials Science, 797 Changwon-daero, Seongsan-guFunctional Ceramics Department, Korea Institute of Materials Science, 797 Changwon-daero, Seongsan-guFunctional Ceramics Department, Korea Institute of Materials Science, 797 Changwon-daero, Seongsan-guFunctional Ceramics Department, Korea Institute of Materials Science, 797 Changwon-daero, Seongsan-guSchool of Materials Science and Engineering, Pusan National University, 2, Busandaehak-ro 63beon-gilReliability Research Center, Korea Electronics Technology InstituteFunctional Ceramics Department, Korea Institute of Materials Science, 797 Changwon-daero, Seongsan-guAbstract A ceramic substrate must not only have an excellent thermal performance but also be thin, since the electronic devices have to become thin and small in the electronics industry of the next generation. In this manuscript, a thin ceramic substrate (thickness: 30–70 µm) is reported for the next generation ceramic substrate. It is fabricated by a new process [granule spray in vacuum (GSV)] which is a room temperature process. For the thin ceramic substrates, AlN GSV films are deposited on Al substrates and their electric/thermal properties are compared to those of the commercial ceramic substrates. The thermal resistance is significantly reduced by using AlN GSV films instead of AlN bulk-ceramics in thermal management systems. It is due to the removal of a thermal interface material which has low thermal conductivity. In particular, the dielectric strengths of AlN GSV films are much higher than those of AlN bulk-ceramics which are commercialized, approximately 5 times. Therefore, it can be expected that this GSV film is a next generation substrate in thermal management systems for the high power application.https://doi.org/10.1038/s41598-017-06774-z |
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DOAJ |
language |
English |
format |
Article |
sources |
DOAJ |
author |
Yuna Kim Cheol-Woo Ahn Jong-Jin Choi Jungho Ryu Jong-Woo Kim Woon-Ha Yoon Dong-Soo Park Seog-Young Yoon Byungjin Ma Byung-Dong Hahn |
spellingShingle |
Yuna Kim Cheol-Woo Ahn Jong-Jin Choi Jungho Ryu Jong-Woo Kim Woon-Ha Yoon Dong-Soo Park Seog-Young Yoon Byungjin Ma Byung-Dong Hahn Next Generation Ceramic Substrate Fabricated at Room Temperature Scientific Reports |
author_facet |
Yuna Kim Cheol-Woo Ahn Jong-Jin Choi Jungho Ryu Jong-Woo Kim Woon-Ha Yoon Dong-Soo Park Seog-Young Yoon Byungjin Ma Byung-Dong Hahn |
author_sort |
Yuna Kim |
title |
Next Generation Ceramic Substrate Fabricated at Room Temperature |
title_short |
Next Generation Ceramic Substrate Fabricated at Room Temperature |
title_full |
Next Generation Ceramic Substrate Fabricated at Room Temperature |
title_fullStr |
Next Generation Ceramic Substrate Fabricated at Room Temperature |
title_full_unstemmed |
Next Generation Ceramic Substrate Fabricated at Room Temperature |
title_sort |
next generation ceramic substrate fabricated at room temperature |
publisher |
Nature Publishing Group |
series |
Scientific Reports |
issn |
2045-2322 |
publishDate |
2017-07-01 |
description |
Abstract A ceramic substrate must not only have an excellent thermal performance but also be thin, since the electronic devices have to become thin and small in the electronics industry of the next generation. In this manuscript, a thin ceramic substrate (thickness: 30–70 µm) is reported for the next generation ceramic substrate. It is fabricated by a new process [granule spray in vacuum (GSV)] which is a room temperature process. For the thin ceramic substrates, AlN GSV films are deposited on Al substrates and their electric/thermal properties are compared to those of the commercial ceramic substrates. The thermal resistance is significantly reduced by using AlN GSV films instead of AlN bulk-ceramics in thermal management systems. It is due to the removal of a thermal interface material which has low thermal conductivity. In particular, the dielectric strengths of AlN GSV films are much higher than those of AlN bulk-ceramics which are commercialized, approximately 5 times. Therefore, it can be expected that this GSV film is a next generation substrate in thermal management systems for the high power application. |
url |
https://doi.org/10.1038/s41598-017-06774-z |
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