Q-Function-Based Traffic- and Thermal-Aware Adaptive Routing for 3D Network-on-Chip
Die-stacking technology is expanding the space diversity of on-chip communications by leveraging through-silicon-via (TSV) integration and wafer bonding. The 3D network-on-chip (NoC), a combination of die-stacking technology and systematic on-chip communication infrastructure, suffers from increased...
| Main Authors: | , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2020-02-01
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| Series: | Electronics |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2079-9292/9/3/392 |