Q-Function-Based Traffic- and Thermal-Aware Adaptive Routing for 3D Network-on-Chip
Die-stacking technology is expanding the space diversity of on-chip communications by leveraging through-silicon-via (TSV) integration and wafer bonding. The 3D network-on-chip (NoC), a combination of die-stacking technology and systematic on-chip communication infrastructure, suffers from increased...
Main Authors: | Seung Chan Lee, Tae Hee Han |
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Format: | Article |
Language: | English |
Published: |
MDPI AG
2020-02-01
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Series: | Electronics |
Subjects: | |
Online Access: | https://www.mdpi.com/2079-9292/9/3/392 |
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