Thermoelectric transport enhancement of Te-rich bismuth antimony telluride (Bi0.5Sb1.5Te3+x) through controlled porosity

Alloys of Bi2Te3 and Sb2Te3 are the best performing p-type thermoelectrics near room temperature and have been the subject of extensive engineering efforts. Dramatic improvement is achieved by introducing defects that effectively scatter phonons and reduce thermal conductivity. Unfortunately, outsta...

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Main Authors: Ian T. Witting, Jann A. Grovogui, Vinayak P. Dravid, G. Jeffrey Snyder
Format: Article
Language:English
Published: Elsevier 2020-09-01
Series:Journal of Materiomics
Subjects:
Online Access:http://www.sciencedirect.com/science/article/pii/S2352847820300344
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spelling doaj-29096c0f1bac4dc9bc0ad214ca5891be2020-11-25T03:18:53ZengElsevierJournal of Materiomics2352-84782020-09-0163532544Thermoelectric transport enhancement of Te-rich bismuth antimony telluride (Bi0.5Sb1.5Te3+x) through controlled porosityIan T. Witting0Jann A. Grovogui1Vinayak P. Dravid2G. Jeffrey Snyder3Department of Materials Science and Engineering, Northwestern University, 2220 Campus Drive, Cook Hall 2036, Evanston, IL, 60208, USADepartment of Materials Science and Engineering, Northwestern University, 2220 Campus Drive, Cook Hall 2036, Evanston, IL, 60208, USACorresponding author.; Department of Materials Science and Engineering, Northwestern University, 2220 Campus Drive, Cook Hall 2036, Evanston, IL, 60208, USACorresponding author.; Department of Materials Science and Engineering, Northwestern University, 2220 Campus Drive, Cook Hall 2036, Evanston, IL, 60208, USAAlloys of Bi2Te3 and Sb2Te3 are the best performing p-type thermoelectrics near room temperature and have been the subject of extensive engineering efforts. Dramatic improvement is achieved by introducing defects that effectively scatter phonons and reduce thermal conductivity. Unfortunately, outstanding results are often difficult to reproduce as the process variables involved are difficult to control or possibly unknown. Here, a reproducible and controllable method of fabricating porous Bi0.5Sb1.5Te3+x is presented. While effective medium theory (EMT) predicts no benefit, improvements in the thermoelectric quality factor, B (which determines the maximum zT of a materials), were as high as 45% parallel to the pressing direction for a sample of roughly 20% porosity. The study of microstructural evolution with increasing porosity is facilitated by a combination of Scanning/Transmission Electron Microscopy (S/TEM) and Electron Backscattered Diffraction (EBSD). This study reveals a statistically significant shift in the distribution of grain boundaries favoring lower energy twins, which coincides with an increase in the presence of stepped twin boundaries. This work demonstrates the potential benefits of careful grain boundary engineering and the need for further detailed studies of the dependence of thermal and electrical transport on grain boundary structure and orientation in these alloys.http://www.sciencedirect.com/science/article/pii/S2352847820300344Bismuth antimony tellurideThermoelectricPorosityTransport modelingFoaming
collection DOAJ
language English
format Article
sources DOAJ
author Ian T. Witting
Jann A. Grovogui
Vinayak P. Dravid
G. Jeffrey Snyder
spellingShingle Ian T. Witting
Jann A. Grovogui
Vinayak P. Dravid
G. Jeffrey Snyder
Thermoelectric transport enhancement of Te-rich bismuth antimony telluride (Bi0.5Sb1.5Te3+x) through controlled porosity
Journal of Materiomics
Bismuth antimony telluride
Thermoelectric
Porosity
Transport modeling
Foaming
author_facet Ian T. Witting
Jann A. Grovogui
Vinayak P. Dravid
G. Jeffrey Snyder
author_sort Ian T. Witting
title Thermoelectric transport enhancement of Te-rich bismuth antimony telluride (Bi0.5Sb1.5Te3+x) through controlled porosity
title_short Thermoelectric transport enhancement of Te-rich bismuth antimony telluride (Bi0.5Sb1.5Te3+x) through controlled porosity
title_full Thermoelectric transport enhancement of Te-rich bismuth antimony telluride (Bi0.5Sb1.5Te3+x) through controlled porosity
title_fullStr Thermoelectric transport enhancement of Te-rich bismuth antimony telluride (Bi0.5Sb1.5Te3+x) through controlled porosity
title_full_unstemmed Thermoelectric transport enhancement of Te-rich bismuth antimony telluride (Bi0.5Sb1.5Te3+x) through controlled porosity
title_sort thermoelectric transport enhancement of te-rich bismuth antimony telluride (bi0.5sb1.5te3+x) through controlled porosity
publisher Elsevier
series Journal of Materiomics
issn 2352-8478
publishDate 2020-09-01
description Alloys of Bi2Te3 and Sb2Te3 are the best performing p-type thermoelectrics near room temperature and have been the subject of extensive engineering efforts. Dramatic improvement is achieved by introducing defects that effectively scatter phonons and reduce thermal conductivity. Unfortunately, outstanding results are often difficult to reproduce as the process variables involved are difficult to control or possibly unknown. Here, a reproducible and controllable method of fabricating porous Bi0.5Sb1.5Te3+x is presented. While effective medium theory (EMT) predicts no benefit, improvements in the thermoelectric quality factor, B (which determines the maximum zT of a materials), were as high as 45% parallel to the pressing direction for a sample of roughly 20% porosity. The study of microstructural evolution with increasing porosity is facilitated by a combination of Scanning/Transmission Electron Microscopy (S/TEM) and Electron Backscattered Diffraction (EBSD). This study reveals a statistically significant shift in the distribution of grain boundaries favoring lower energy twins, which coincides with an increase in the presence of stepped twin boundaries. This work demonstrates the potential benefits of careful grain boundary engineering and the need for further detailed studies of the dependence of thermal and electrical transport on grain boundary structure and orientation in these alloys.
topic Bismuth antimony telluride
Thermoelectric
Porosity
Transport modeling
Foaming
url http://www.sciencedirect.com/science/article/pii/S2352847820300344
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