ACA Curing Process Optimization Based on Curing Degree Considering Shear Strength of Joints

ACA Curing Process Optimization Based on Curing Degree Considering Shear Strength of Joints

This paper presents an optimized curing process for the shear strength achievement and retention for anisotropic conductive adhesive (ACA) flip-chip interconnections. The curing kinetics of ACA is first presented and then a curing degree (α) relationship between curing temperature T and c...

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Bibliographic Details
Main Authors: Guanghua Wu, Meixian Jiang, Diganta Das, Michael Pecht
Format: Article
Language:English
Published: IEEE 2019-01-01
Series:IEEE Access
Subjects:
Curing degree
ACA
parameters optimization
shear strength
Online Access:https://ieeexplore.ieee.org/document/8932490/

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