Thermal Characteristics of InGaN/GaN Flip-Chip Light Emitting Diodes with Diamond-Like Carbon Heat-Spreading Layers
The temperature-dependent optical, electrical, and thermal properties of flip-chip light emitting diodes (FCLEDs) with diamond-like carbon (DLC) heat-spreading layers were investigated. On the basis of the measured results in the 20°C to 100°C temperature range, a significant performance improvement...
| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Hindawi Limited
2014-01-01
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| Series: | International Journal of Photoenergy |
| Online Access: | http://dx.doi.org/10.1155/2014/829284 |
| Summary: | The temperature-dependent optical, electrical, and thermal properties of flip-chip light emitting diodes (FCLEDs) with diamond-like carbon (DLC) heat-spreading layers were investigated. On the basis of the measured results in the 20°C to 100°C temperature range, a significant performance improvement can be achieved for FCLEDs with DLC heat-spreading layers (DLC-FCLED) compared with FCLEDs without DLC heat-spreading layers (non-DLC-FCLED). The external quantum efficiency (EQE) of the DLC-FCLED improves by 9% at an injection current of 1000 mA and a temperature of 100°C. The forward voltage and spectra variations are smaller than those of non-DLC-FCLEDs. The DLC-FCLED provides high efficiency and high stability performance for high-power and high-temperature applications. |
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| ISSN: | 1110-662X 1687-529X |