Correlation between the Microstructures of Bonding Interfaces and the Shear Strength of Cu-to-Cu Joints Using (111)-Oriented and Nanotwinned Cu
Highly (111)-oriented Cu pillar-bumps were bonded to highly (111)-oriented Cu films at temperatures ranging from 200 °C/100 °C to 350 °C/100 °C in N<sub>2</sub> ambient conditions. The microstructures of the bonded interfaces affected the shear strengt...
| Main Authors: | , , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2018-11-01
|
| Series: | Materials |
| Subjects: | |
| Online Access: | https://www.mdpi.com/1996-1944/11/12/2368 |
| id |
doaj-323747d401b044098dd05e1dfc8db45b |
|---|---|
| record_format |
Article |
| spelling |
doaj-323747d401b044098dd05e1dfc8db45b2020-11-24T23:58:06ZengMDPI AGMaterials1996-19442018-11-011112236810.3390/ma11122368ma11122368Correlation between the Microstructures of Bonding Interfaces and the Shear Strength of Cu-to-Cu Joints Using (111)-Oriented and Nanotwinned CuJing-Ye Juang0Chia-Ling Lu1Yu-Jin Li2K. N. Tu3Chih Chen4Department of Materials Science and Engineering, National Chiao Tung University, Hsinchu 30010, TaiwanDepartment of Materials Science and Engineering, National Chiao Tung University, Hsinchu 30010, TaiwanDepartment of Materials Science and Engineering, National Chiao Tung University, Hsinchu 30010, TaiwanDepartment of Materials Science and Engineering, National Chiao Tung University, Hsinchu 30010, TaiwanDepartment of Materials Science and Engineering, National Chiao Tung University, Hsinchu 30010, TaiwanHighly (111)-oriented Cu pillar-bumps were bonded to highly (111)-oriented Cu films at temperatures ranging from 200 °C/100 °C to 350 °C/100 °C in N<sub>2</sub> ambient conditions. The microstructures of the bonded interfaces affected the shear strength performance of the bonded Cu joints. The bonded interfaces at 300 °C/100 °C and 350 °C/100 °C had far fewer voids than interfaces bonded at 200 °C/100 °C and 250 °C/100 °C. In addition, grain growth took place across the bonding interfaces at temperatures above 300 °C/100 °C. The corresponding orientation map (OIM) showed the preferred orientation of large grown grains to be <100>. Shear tests revealed that the fracture mode was brittle for joints bonded at 200 °C/100 °C, but became ductile after bonded above 300 °C/100 °C. Based on the results, we found that voids and grain growth behavior play import roles in the shear strength performance of bonded Cu joints.https://www.mdpi.com/1996-1944/11/12/2368Cu-to-Cu direct bondingnanotwinned Cusurface diffusiongrain growthshear strength |
| collection |
DOAJ |
| language |
English |
| format |
Article |
| sources |
DOAJ |
| author |
Jing-Ye Juang Chia-Ling Lu Yu-Jin Li K. N. Tu Chih Chen |
| spellingShingle |
Jing-Ye Juang Chia-Ling Lu Yu-Jin Li K. N. Tu Chih Chen Correlation between the Microstructures of Bonding Interfaces and the Shear Strength of Cu-to-Cu Joints Using (111)-Oriented and Nanotwinned Cu Materials Cu-to-Cu direct bonding nanotwinned Cu surface diffusion grain growth shear strength |
| author_facet |
Jing-Ye Juang Chia-Ling Lu Yu-Jin Li K. N. Tu Chih Chen |
| author_sort |
Jing-Ye Juang |
| title |
Correlation between the Microstructures of Bonding Interfaces and the Shear Strength of Cu-to-Cu Joints Using (111)-Oriented and Nanotwinned Cu |
| title_short |
Correlation between the Microstructures of Bonding Interfaces and the Shear Strength of Cu-to-Cu Joints Using (111)-Oriented and Nanotwinned Cu |
| title_full |
Correlation between the Microstructures of Bonding Interfaces and the Shear Strength of Cu-to-Cu Joints Using (111)-Oriented and Nanotwinned Cu |
| title_fullStr |
Correlation between the Microstructures of Bonding Interfaces and the Shear Strength of Cu-to-Cu Joints Using (111)-Oriented and Nanotwinned Cu |
| title_full_unstemmed |
Correlation between the Microstructures of Bonding Interfaces and the Shear Strength of Cu-to-Cu Joints Using (111)-Oriented and Nanotwinned Cu |
| title_sort |
correlation between the microstructures of bonding interfaces and the shear strength of cu-to-cu joints using (111)-oriented and nanotwinned cu |
| publisher |
MDPI AG |
| series |
Materials |
| issn |
1996-1944 |
| publishDate |
2018-11-01 |
| description |
Highly (111)-oriented Cu pillar-bumps were bonded to highly (111)-oriented Cu films at temperatures ranging from 200 °C/100 °C to 350 °C/100 °C in N<sub>2</sub> ambient conditions. The microstructures of the bonded interfaces affected the shear strength performance of the bonded Cu joints. The bonded interfaces at 300 °C/100 °C and 350 °C/100 °C had far fewer voids than interfaces bonded at 200 °C/100 °C and 250 °C/100 °C. In addition, grain growth took place across the bonding interfaces at temperatures above 300 °C/100 °C. The corresponding orientation map (OIM) showed the preferred orientation of large grown grains to be <100>. Shear tests revealed that the fracture mode was brittle for joints bonded at 200 °C/100 °C, but became ductile after bonded above 300 °C/100 °C. Based on the results, we found that voids and grain growth behavior play import roles in the shear strength performance of bonded Cu joints. |
| topic |
Cu-to-Cu direct bonding nanotwinned Cu surface diffusion grain growth shear strength |
| url |
https://www.mdpi.com/1996-1944/11/12/2368 |
| work_keys_str_mv |
AT jingyejuang correlationbetweenthemicrostructuresofbondinginterfacesandtheshearstrengthofcutocujointsusing111orientedandnanotwinnedcu AT chialinglu correlationbetweenthemicrostructuresofbondinginterfacesandtheshearstrengthofcutocujointsusing111orientedandnanotwinnedcu AT yujinli correlationbetweenthemicrostructuresofbondinginterfacesandtheshearstrengthofcutocujointsusing111orientedandnanotwinnedcu AT kntu correlationbetweenthemicrostructuresofbondinginterfacesandtheshearstrengthofcutocujointsusing111orientedandnanotwinnedcu AT chihchen correlationbetweenthemicrostructuresofbondinginterfacesandtheshearstrengthofcutocujointsusing111orientedandnanotwinnedcu |
| _version_ |
1725451956397277184 |