| Summary: | In this study, five AlTiCrN nitride coatings were deposited via high-power impulse magnetron sputtering (HiPIMS). The AlTiCrN coatings were synthesized with high contents of Al or Ti and a lower fraction of Cr, using Ti and Al<sub>70</sub>Cr<sub>30</sub> targets with five different input power ratios. Electron probe microanalyzer results revealed that the increased rate of Ti contents in the coatings can be divided into two regions due to the difference of power densities for HiPIMS (>0.5 kW/cm<sup>2</sup>) and modulated pulsed power (MPP) (<0.5 kW/cm<sup>2</sup>). The deposition rate and thickness of the coatings depended on the sputtering yield of two metal targets under HiPIMS and MPP modes. The grain size of the coatings decreased from 60 to 40 nm as the input power ratios of the AlCr/Ti targets decreased due to their lower thickness values and lower Al content. Selected area electron diffraction patterns and X-ray diffraction results revealed that the TiN and AlTiN phases can be found in the coating containing higher Ti content, whereas the AlN, CrN, and AlCrN phases were observed in the coating with a higher Al concentration. Nevertheless, decreasing the concentration of Ti had a detrimental effect on the mechanical properties of AlTiCrN coatings, due to a promotion in grain size and the formation of AlN, which is softer than TiN. It is noticed that our results differed from those in previous reports, in which a grain refinement effect was observed due to increasing Al content. In this work, the effect of processing the parameters of the HiPIMS and MPP power systems on the grain size and the mechanical property of the coating was also discussed.
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