Comparison of Ultrasonic Welding and Thermal Bonding for the Integration of Thin Film Metal Electrodes in Injection Molded Polymeric Lab-on-Chip Systems for Electrochemistry

Comparison of Ultrasonic Welding and Thermal Bonding for the Integration of Thin Film Metal Electrodes in Injection Molded Polymeric Lab-on-Chip Systems for Electrochemistry

We compare ultrasonic welding (UW) and thermal bonding (TB) for the integration of embedded thin-film gold electrodes for electrochemical applications in injection molded (IM) microfluidic chips. The UW bonded chips showed a significantly superior electrochemical performance compared to the ones obt...

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Bibliographic Details
Main Authors: Marco Matteucci, Arto Heiskanen, Kinga Zór, Jenny Emnéus, Rafael Taboryski
Format: Article
Language:English
Published: MDPI AG 2016-10-01
Series:Sensors
Subjects:
ultrasonic welding
metal electrodes
injection molding
electrochemistry
microfluidics
Online Access:http://www.mdpi.com/1424-8220/16/11/1795

Internet

http://www.mdpi.com/1424-8220/16/11/1795

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